Processes for increasing the chemical resistance of a surface of a formed article are disclosed. The formed article is produced from a polymeric composition comprising a photoactive additive containing photoactive groups derived from a monofunctional benzophenone. The surface of the formed article is then exposed to ultraviolet light to cause crosslinking of the photoactive additive and produce a crosslinked surface. The crosslinking enhances the chemical resistance of the surface. Various means for controlling the depth of the crosslinking are also discussed.

Processes for increasing the chemical resistance of a surface of a formed article are disclosed. The formed article is produced from a polymeric composition comprising a photoactive additive containing photoactive groups derived from a monofunctional benzophenone. The surface of the formed article is then exposed to ultraviolet light to cause crosslinking of the photoactive additive and produce a crosslinked surface. The crosslinking enhances the chemical resistance of the surface. Various means for controlling the depth of the crosslinking are also discussed.

The disclosure relates to a composition for use in a number of applications including tires. The composition comprises a blend of a rubber component, reinforcing particulate fillers, and based on 100 parts by weight (phr) of the rubber component; from about 5 phr to about 70 phr of a terpene phenol resin having a softening point temperature in the range of from about 100 C. to about 170 C. and having a hydroxyl value in the range from about 5 to about 30. In one embodiment, the terpene phenol resin has a number average molecular weight of from about 700 Da to about 790 Da, a weight average molecular weight of from about 930 Da to about 1090 Da, and a polydispersity index of from about 1.25 to about 1.45.

The disclosure relates to a composition for use in a number of applications including tires. The composition comprises a blend of a rubber component, reinforcing particulate fillers, and based on 100 parts by weight (phr) of the rubber component; from about 5 phr to about 70 phr of a terpene phenol resin having a softening point temperature in the range of from about 100 C. to about 170 C. and having a hydroxyl value in the range from about 5 to about 30. In one embodiment, the terpene phenol resin has a number average molecular weight of from about 700 Da to about 790 Da, a weight average molecular weight of from about 930 Da to about 1090 Da, and a polydispersity index of from about 1.25 to about 1.45.

Certain embodiments are directed to cyanate resin blends comprising, for example, a mixture of a cyanate monomer and a cyanate oligomer. The resin blends are effective to provide a dielectric constant of less than 2.7, a glass transition temperature of at least 150 C. and a moisture absorption of less than 1.5%. Radomes using the resin are also described.

Certain embodiments are directed to cyanate resin blends comprising, for example, a mixture of a cyanate monomer and a cyanate oligomer. The resin blends are effective to provide a dielectric constant of less than 2.7, a glass transition temperature of at least 150 C. and a moisture absorption of less than 1.5%. Radomes using the resin are also described.

Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising SiO linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising SiO linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1Tmf2)3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1Cd2)3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C1>C2 and (C1C2)3 percent.

A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1Tmf2)3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1Cd2)3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C1>C2 and (C1C2)3 percent.