The present invention relates to the use of a polyhydric alcohol in a polyamide polymerization process for giving the modified polyamide obtained increased stability toward heat, light and/or bad weather. The invention also relates to a polyamide modified in this way, and also to polyamide compositions that may be used for the preparation of specific articles liable to be subjected to high temperatures.

Processing reinforcing fiber products to recover reinforcing fibers by removing other material, such fiber sizing material and/or matrix material from the reinforcing fibers. The processing includes cosolvent treating the reinforcing fiber product with a cosolvent composition including a normally-liquid first solvent portion and a normally-gaseous second solvent portion under conditions of temperature and pressure at which the cosolvent composition is in the form of a single fluid phase that is a liquid or a supercritical fluid. The processing may be performed in a continuous manner to recover the continuous reinforcing fibers in a continuous form.

Processing reinforcing fiber products to recover reinforcing fibers by removing other material, such fiber sizing material and/or matrix material from the reinforcing fibers. The processing includes cosolvent treating the reinforcing fiber product with a cosolvent composition including a normally-liquid first solvent portion and a normally-gaseous second solvent portion under conditions of temperature and pressure at which the cosolvent composition is in the form of a single fluid phase that is a liquid or a supercritical fluid. The processing may be performed in a continuous manner to recover the continuous reinforcing fibers in a continuous form.

A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a reactive diluent such as N-vinylformamide, the composition not including a solvent. The solvent-free light-curable adhesive composition has good compatibility with acrylic materials and the like, which are adhesive components, even without including a solvent. ##STR00001##

A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a reactive diluent such as N-vinylformamide, the composition not including a solvent. The solvent-free light-curable adhesive composition has good compatibility with acrylic materials and the like, which are adhesive components, even without including a solvent. ##STR00001##

A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.

Provided is a polymer composition, wherein the polymer composition has a refractive index difference (BA) of 0.04 or greater but 0.1 or less between a minimum refractive index A of the polymer composition in a temperature range of 5 degrees C. or higher but lower than 30 degrees C. and a maximum refractive index B of the polymer composition in a temperature range of 30 degrees C. or higher but lower than 50 degrees C.

Provided is a polymer composition, wherein the polymer composition has a refractive index difference (BA) of 0.04 or greater but 0.1 or less between a minimum refractive index A of the polymer composition in a temperature range of 5 degrees C. or higher but lower than 30 degrees C. and a maximum refractive index B of the polymer composition in a temperature range of 30 degrees C. or higher but lower than 50 degrees C.

A polyarylene ether sulfone comprising endgroups of formula (I), a process for its manufacture, a molding composition comprising the polyarylene ether sulfone, use of the molding composition and fiber, film or shaped article produced using the molding composition.

##STR00001##

Various embodiments disclosed relate to a method of forming a polypeptide. The method includes contacting a first amino acid-derived N-thiocarboxyanhydrosulfide monomer as a crystalline solid with a polymerization initiator (e.g., in an alkane suspension) to give a polypeptide product. The method further includes contacting the polypeptide product with a second amino acid-derived N-thiocarboxyanhydrosulfide monomer in an alkane suspension.