Patent classifications
C08G73/00
MOLD ASSEMBLY AND METHOD OF MOLDING A COMPONENT
A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths
Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths
Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
Thermoplastic (co)polyimides and synthesis methods
A salt composition includes at least one ammonium carboxylate salt obtained from: (a) at least one aromatic compound comprising 2 anhydride functional groups and/or its carboxylic acid and/or ester derivatives; and (b) one or more aliphatic diamines in which said aliphatic diamine or diamines are chosen from the diamines of formula (I) NH.sub.2RNH.sub.2 with R being a saturated aliphatic divalent hydrocarbon radical, the two amine functional groups of which are separated by 4 to 6 carbon atoms and 1 or 2 hydrogen atoms of the divalent radical of which are replaced by 1 or 2 methyl and/or ethyl groups; and optionally the diamines of formula (II) NH.sub.2RNH.sub.2 with R being a saturated or unsaturated and aliphatic, cycloaliphatic or arylaliphatic divalent hydrocarbon radical, which optionally comprises heteroatoms; and at least one chain-limiting compound chosen from monoamines, monoacids or diacids in the , positions.
Thermoplastic (co)polyimides and synthesis methods
A salt composition includes at least one ammonium carboxylate salt obtained from: (a) at least one aromatic compound comprising 2 anhydride functional groups and/or its carboxylic acid and/or ester derivatives; and (b) one or more aliphatic diamines in which said aliphatic diamine or diamines are chosen from the diamines of formula (I) NH.sub.2RNH.sub.2 with R being a saturated aliphatic divalent hydrocarbon radical, the two amine functional groups of which are separated by 4 to 6 carbon atoms and 1 or 2 hydrogen atoms of the divalent radical of which are replaced by 1 or 2 methyl and/or ethyl groups; and optionally the diamines of formula (II) NH.sub.2RNH.sub.2 with R being a saturated or unsaturated and aliphatic, cycloaliphatic or arylaliphatic divalent hydrocarbon radical, which optionally comprises heteroatoms; and at least one chain-limiting compound chosen from monoamines, monoacids or diacids in the , positions.
Metal fine particle dispersant containing branched polymer compound having ammonium group
A complex that includes a metal fine particle dispersant including a branched polymer compound having an ammonium group and having a weight average molecular weight of 500 to 5,000,000; and a metal fine particle, wherein the metal fine particle includes platinum (Pt) or palladium (Pd), the metal fine particle dispersant includes a branched polymer compound of Formula (1): ##STR00001##
Metal fine particle dispersant containing branched polymer compound having ammonium group
A complex that includes a metal fine particle dispersant including a branched polymer compound having an ammonium group and having a weight average molecular weight of 500 to 5,000,000; and a metal fine particle, wherein the metal fine particle includes platinum (Pt) or palladium (Pd), the metal fine particle dispersant includes a branched polymer compound of Formula (1): ##STR00001##
Polymers, substrates, methods for making such, and devices comprising the same
The present invention relates generally to substrates for making polymers and methods for making polymers. The present invention also relates generally to polymers and devices comprising the same.
Resin composition and prepreg, resin sheet, laminate, and printed circuit board
A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: ##STR00001##
wherein R.sub.a represents a group represented by the following general formula (c), ##STR00002##
Resin composition and prepreg, resin sheet, laminate, and printed circuit board
A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: ##STR00001##
wherein R.sub.a represents a group represented by the following general formula (c), ##STR00002##