A photosensor element that is capable of achieving a good balance between high photoelectric conversion efficiency and low dark current is able to be obtained by using a composition for forming a hole collecting layer of a photosensor element, which contains an organic solvent and a charge-transporting material that is composed, for example, of an aniline derivative or thiophene derivative represented by one of formulae (AA)-(DD) and having a molecular weight of 200-2,000. ##STR00001##

A carbon nanotube (CNT)/polymer film or CNT/polymer composite structure containing CNTs, arranged uniformly in a randomly oriented distribution in the polymer matrix. The CNT sheet is manufactured by applying a highly dispersed CNT-polymer-solvent suspension, mixed using ultrasonication, over a carrier, using a coating process, and drying to form the CNT/polymer film. The CNT film is useful in making CNT composite laminates and structures having utility for electro-thermal heating, deicing, shielding for wire & cable, thermal interface pads, energy storage, heat dissipation, conductive composites, antennas, reflectors, and electromagnetic environmental effects (E3), such as lightning strike protection, EMP protection, directed energy protection, and EMI shielding in a variety of form factors such as sheets, roll stocks, and tapes.

Novel aromatic polyimides are disclosed with sufficient physical properties to be useful in 3D printing.

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

The present invention includes polycationic amphiphilic compounds of formula VII useful as antimicrobial agents. ##STR00001## The present invention further includes novel polymers of polycationic amphiphilic compounds useful as antimicrobial agents. The present invention further includes methods useful for removing microorganisms and/or biofilm-embedded microorganisms from a surface. The present invention further includes compositions and methods useful for preventing or reducing the growth or proliferation of microorganisms and/or biofilm-embedded microorganisms on a surface.

The present invention includes polycationic amphiphilic compounds of formula VII useful as antimicrobial agents. ##STR00001## The present invention further includes novel polymers of polycationic amphiphilic compounds useful as antimicrobial agents. The present invention further includes methods useful for removing microorganisms and/or biofilm-embedded microorganisms from a surface. The present invention further includes compositions and methods useful for preventing or reducing the growth or proliferation of microorganisms and/or biofilm-embedded microorganisms on a surface.

A method of producing a thermally rearranged polybenzoxazole, polybenzimidazole or polybenzothiazole (collectively denominated TR PBX), thermally arranged PBX and membranes including the same.

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.