A polymer including reacted units of 1,3,5-trihydroxybenzene and a compound A represented by Formula (I) below,

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in Formula (I), n=0-5. Compound A is bonded to the 1,3,5-trihydroxybenzene through an azo bond to form the polymer, represented by Formula (II) below,

##STR00002##

Formula (II), represents a repeating unit of the polymer.

The present invention relates to a method for producing amphiphilic functionalized highly branched melamine-polyamine polymers by condensing melamine and optionally a melamine derivate having at least one different amine having at least two primary amino groups and optionally also with urea and/or at least one urea derivative and/or with at least one at least difunctional diisocyanate or polyisocyanate and/or at least one carbolic acid having at least two carboxyl groups or at least one derivative thereof, optionally quaternizing a portion of the amino groups of the polymer thereby obtained, reacting the polymer thus obtained with at least one compound capable of undergoing a condensation or addition reaction with amino groups, and optionally quaternizing at least part of the amino groups of the polymer obtained in the first step. The invention further relates to the amphiphilic functionalized highly branched melamine-polyamine polymers that can be obtained by the method according to the invention, and to the use thereof as surface active agents.

Water-insoluble anion exchange materials which exhibit improved insolubility in water are used, for example, for anion exchange membranes or as anion exchange resins. The water-insoluble anion exchange materials are at least composed of linearly polymerized and/or branched and/or crosslinked anion exchange groups C, which are part of the structural units according to at least one of the general formulas I to VIII: ##STR00001## ##STR00002##

The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Foam compositions are provided. The compositions are prepared from multi-functional acetoacetate esters and multi-functional amines or acrylates. The foam compositions can include one or more additives. The foam compositions can be used for home and commercial insulation, air sealing, sound proofing, structural improvement, and exterior roofing, among other applications. The foam compositions provide advantages of being isocyanate free and offer reduced exposure to isocyanate.

A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound:

##STR00001##

wherein R.sub.a represents a group represented by the following general formula (c),

##STR00002##

Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer.

The heat-curable resin composition of the invention contains: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; and (D) a spherical inorganic filler.

Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer.

The heat-curable resin composition of the invention contains: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; and (D) a spherical inorganic filler.

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.