The present disclosure provides a method for preparing multi-component polymers through post-polymerization modification, used to functionalize polysulfonyl imidate polymer including a dispersing polymer reactant, an electrophilic substitution reagent and a catalyst in an organic dispersant; adding acid-binding agent to react at room temperature for 4-48 h; obtaining the precipitate when the reaction finished; washing and drying the obtained precipitate to get the functionalized multi-component polymers. The present disclosure involves a low polymerization temperature, allowing for the reaction to occur at room temperature. Additionally, the conversion rate is high, and the applicable electrophilic substitution monomer reagents have a wide selection. Besides that, the synthesis cost of the reaction is low due to the widespread availability of common chemical reagents such as catalysts, organic dispersants, acid binding agents, and other reaction reagents. The ease of access to these raw materials contributes to the overall affordability of the synthesis process.

The present disclosure provides a method for preparing multi-component polymers through post-polymerization modification, used to functionalize polysulfonyl imidate polymer including a dispersing polymer reactant, an electrophilic substitution reagent and a catalyst in an organic dispersant; adding acid-binding agent to react at room temperature for 4-48 h; obtaining the precipitate when the reaction finished; washing and drying the obtained precipitate to get the functionalized multi-component polymers. The present disclosure involves a low polymerization temperature, allowing for the reaction to occur at room temperature. Additionally, the conversion rate is high, and the applicable electrophilic substitution monomer reagents have a wide selection. Besides that, the synthesis cost of the reaction is low due to the widespread availability of common chemical reagents such as catalysts, organic dispersants, acid binding agents, and other reaction reagents. The ease of access to these raw materials contributes to the overall affordability of the synthesis process.

The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.

A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.

The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a cyanate compound (B). ##STR00001## wherein R each independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a proportion of R representing a methyl group, among all R, is 50 mol % or more, and n represents an integer of 0 to 2.

Disclosed herein are ionic polymers incorporating an cationic atom in the polymer backbone.

A nanoporous aerogel comprising an acid-catalyzed, oxidatively aromatized PBO polymer. The nanoporous aerogel includes a benzoxazine moiety containing polybenzoxazine polymer with up-to six sites of cross-linking per unit is the product of the high yield, room temperature, and acid catalyzed synthesis method, as provided for herein. A method of producing the aerogel is providing that results in robust monoliths, oxidative aromatization, and conversion to nanoporous carbons for the provided aerogels. The PBO polymer may be co-generated as an interpenetrating network with a metal oxide network, wherein the PBO network serves as both a reactive template and as a sacrificial scaffold in the synthesis of the pure, nanoporous, monolithic metal aerogels, in an energy efficient method. ##STR00001##

Polyguanidines and methods of use thereof are described. In particular, polyguanidines of formula (I), formula (II), and formula (III) are described. The polyguanidines can be used to treat infection, such as bacterial, viral or fungal infection, and as an ex vivo microbial agent. ##STR00001##