A polymer comprising at least one unit of the formula (1) wherein T.sup.1 is a carbon atom or a nitrogen atom, T.sup.2 is a carbon atom if T.sup.1 is a nitrogen atom, or is a nitrogen atom if T.sup.1 is a carbon atom, r is 1, 2, 3 or 4, s is 1, 2, 3, or 4, M.sup.1 is preferably selected from the group consisting of M.sup.2 is preferably The polymers are prepared by reacting monomers (1a) with monomers (2a) H.sub.2N-[-M.sup.1-]r-NH.sub.2 (1a) OHC-[-M.sup.2-]s-CHO (2a) or the step of reacting monomers (1b) with monomers (2b) OHC-[-M.sup.1-]r-CHO (1b) H.sub.2N-[-M.sup.2-]s-NH.sub.2 (2b). ##STR00001##

The conductive film of the present invention includes a conductive polymer (A) and has a film thickness of 35 nm or less, wherein: a surface resistance of the conductive film is 110.sup.11 /sq. or less, and a standard deviation of current that flows through the conductive film upon application of voltage to the conductive film is 5 or less. The conductor of the present invention has a substrate, and the conductive film provided on at least a part of the surface of the substrate. The resist pattern forming method of the present invention includes a lamination step of forming the conductive film on a surface of a resist layer including a chemically amplified resist, said resist layer formed on one surface of a substrate, and an exposure step of irradiating the substrate with an electron beam according to a pattern on its side on which the conductive film is formed. The laminate of the present invention has a resist layer and an antistatic film formed on the surface of the resist layer, wherein the antistatic film is the above-mentioned conductive film.

A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator,
in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).

Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator,
in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

A method of making a polyetherimide comprises: combining a bisphenol A dianhydride, p-phenylene diamine and a halogenated aromatic solvent to form a reactant solution; heating the reactant solution to a temperature of 205 C. to 330 C. at a pressure sufficient to prevent boiling to afford a reaction solution; removing water from the reaction solution; maintaining the reaction solution at a temperature of 205 C. to 330 C. and a pressure sufficient to prevent boiling for 10 minutes to 5 hours to form a product mixture comprising the polyetherimide and solvent; and isolating the polyetherimide.