Patent classifications
C08G73/00
FOAM COMPOSITIONS
Foam compositions are provided. The compositions are prepared from multi-functional acetoacetate esters and multi-functional amines or acrylates. The foam compositions can include one or more additives. The foam compositions can be used for home and commercial insulation, air sealing, sound proofing, structural improvement, and exterior roofing, among other applications. The foam compositions provide advantages of being isocyanate free and offer reduced exposure to isocyanate.
FOAM COMPOSITIONS
Foam compositions are provided. The compositions are prepared from multi-functional acetoacetate esters and multi-functional amines or acrylates. The foam compositions can include one or more additives. The foam compositions can be used for home and commercial insulation, air sealing, sound proofing, structural improvement, and exterior roofing, among other applications. The foam compositions provide advantages of being isocyanate free and offer reduced exposure to isocyanate.
BISPHENOL M DIPHTHALONITRILE ETHER RESIN BLENDS INCLUDING A FILLER, AND ARTICLES
The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.
Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
Brush-poly (glycoamidoamine)-lipids and uses thereof
The present disclosure provides brush-poly(glycoamidoamine)-lipids (PGALs) (e.g., polymers of any one of Formulae (I)-(IV)) and methods of preparing the PGALs. A described PGAL may include poly(glycoamidoamine)-derived moieties (e.g., ##STR00001##
such as ##STR00002##
which may assist the PGAL and/or a complex of the PGAL and an agent to pass through cell membranes or be taken up by cells. Also provided are compositions including a described PGAL and an agent (e.g., polynucleotide, small molecule, peptide, or protein). The present disclosure also provides methods, kits, and uses that include or involve the PGALs or compositions for delivering an agent to a subject, tissue, or cell and/or for treating and/or preventing in a subject a range of diseases, such as genetic diseases, proliferative diseases, hematological diseases, neurological diseases, immunological diseases, gastrointestinal diseases, respiratory diseases, painful conditions, psychiatric disorders, musculoskeletal diseases, genitourinary diseases, and metabolic disorders ##STR00003##
Brush-poly (glycoamidoamine)-lipids and uses thereof
The present disclosure provides brush-poly(glycoamidoamine)-lipids (PGALs) (e.g., polymers of any one of Formulae (I)-(IV)) and methods of preparing the PGALs. A described PGAL may include poly(glycoamidoamine)-derived moieties (e.g., ##STR00001##
such as ##STR00002##
which may assist the PGAL and/or a complex of the PGAL and an agent to pass through cell membranes or be taken up by cells. Also provided are compositions including a described PGAL and an agent (e.g., polynucleotide, small molecule, peptide, or protein). The present disclosure also provides methods, kits, and uses that include or involve the PGALs or compositions for delivering an agent to a subject, tissue, or cell and/or for treating and/or preventing in a subject a range of diseases, such as genetic diseases, proliferative diseases, hematological diseases, neurological diseases, immunological diseases, gastrointestinal diseases, respiratory diseases, painful conditions, psychiatric disorders, musculoskeletal diseases, genitourinary diseases, and metabolic disorders ##STR00003##
RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a cyanate compound (B).
##STR00001##
wherein R each independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a proportion of R representing a methyl group, among all R, is 50 mol % or more, and n represents an integer of 0 to 2.
Transparent polyamide-imide resin and film using same
Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
Cyanate ester resin composition and prepreg
A cyanate ester resin composition contains: a cyanate ester resin; a curing agent or a curing accelerator; silica microparticles; and core-shell rubber particles; in which the resin composition includes from 1 to 5 parts by mass of the silica microparticles and from 2 to 10 parts by mass of the core-shell rubber particles based on 100 parts by mass of the cyanate ester resin, and a mass ratio of the silica microparticles to the core-shell rubber particles is from 1/1 to 1/5.
LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.