A color conversion panel includes a substrate, a low refractive layer disposed on one surface of the substrate and including a carbosilane-siloxane copolymer, a color conversion layer disposed on the low refractive layer and including a color conversion member and a planarization layer covering the low refractive layer and the color conversion layer, wherein the low refractive layer has a refractive index of less than or equal to 1.30 in a wavelength of 500 nm to 550 nm, and the color conversion member includes a quantum dot, and a manufacturing method thereof is provided.

The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 μm, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 μm or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.

There is provided a silicon compound represented by General Formula (x). There is also provided a reactive material containing a silicon compound represented by General Formula (x). In General Formula (x), in a case where a plurality of R.sup.1's are present, R.sup.1's are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkenyl group having 2 to 10 carbon atoms, a branched alkenyl group having 3 to 10 carbon atoms, or a cyclic alkenyl group having 3 to 10 carbon atoms, where all or part of hydrogen atoms in the alkyl group or the alkenyl group may be substituted with a fluorine atom, in a case where a plurality of R.sup.2's are present, R.sup.2's are each independently a linear alkyl group having 1 to 4 carbon atoms or a branched alkyl group having 3 or 4 carbon atoms, where all or part of hydrogen atoms in the alkyl group may be substituted with a fluorine atom, R.sup.A is an acid unstable group; a is an integer of 1 to 3, b is an integer of 0 to 2, and c is an integer of 1 to 3, where a+b+c=4 is satisfied; and n is an integer of 1 to 5.

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A UV curable silicone composition has exceptional curability by ultraviolet irradiation. The UV curable silicone composition includes (A) an organopolysiloxane composition selected from the following: (A-1) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule, (A-2) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, or (A-3) an organopolysiloxane composition comprising an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, but furthermore comprising an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound, and (B) a silicone-compatible photo-initiator comprising a compound selected from the following: (B-1) an alpha-hydroxyacetophenone, (B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or (B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, wherein the ratio between the thiol groups and alkenyl groups (SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more.

A layer contains a block copolymer in which a microphase-separated structure of the block copolymer has been induced to be perpendicular to a substrate, the process being difficult to perform by means of heating at atmospheric pressure. A method produces this layer. A method produces a semiconductor device in which a vertically phase-separated block copolymer layer is used. The vertically phase-separated block copolymer layer is formed by heating under a pressure below atmospheric pressure and at a temperature at which induced self-assembly can occur. It is preferable that the vertical phase separation includes a lamellar portion. It is preferable that the lamellar portion includes PMMA. It is preferable that the heating temperature is 290° C. or higher. It is preferable to additionally have a layer, which neutralizes the surface energy of the block copolymer, beneath the block copolymer layer.

A thermally stable and solvent resistant conductive polymer composite and its manufacturing friendly preparation method are disclosed. The disclosed composite presents great electrical conductivity with thermal stability and solvent resistance. A method of mixing a host thiophene conjugated polymer and a crosslinkable silane precursor simultaneously introduces both dopant and rigid cross-linked siloxane network into polymer system. The thin film made by the disclosed thermally stable and solvent resistant conductive polymer composite can be applied to fabricate various devices.

A curable silicone composition of the present invention contains certain quantities of straight-chain organopolysiloxane which has at least two alkenyl groups and bound to silicon atoms and ≥0 mol % and <5 mol % of aryl groups per molecule, organopolysiloxane resin having at least two alkenyl groups bound to a silicon atom in the molecule, organohydrogenpolysiloxane resin which has a network molecular structure with at least two hydrogen atoms bound to a silicon atom per molecule, organohydrogenpolysiloxane resin which has a network molecular structure with at least two hydrogen atoms bound to a silicon atom per molecule, only at the end of the molecule, and hydrosilylation reaction catalyst, and (total mols of silicon-atoms-bound) hydrogen atoms/(total mols of silicon-atom-bound alkenyl groups) in the organopolysiloxane in the composition=1-3.

A curable silicone adhesive composition comprising a heat stable siloxane-imide copolymer is shown and described herein. The composition includes an alkenyl silicone, a silicone hydride based cross linker, hydrosilylation catalyst and additives that is curable at relatively low temperatures and shows good heat stability.

A condensation curable silicone adhesive composition comprising a condensation curable organopolysiloxane, siloxane-imide crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability.

A very thin filled silicone foam layer is formed from a composition that includes a curable polysiloxane composition including an alkenyl-substituted polyorganosiloxane, a hydride-substituted polyorganosiloxane, and a cure catalyst; a plurality of expanded polymer microspheres having a largest dimension of less than the thickness of the foam; and a filler composition, wherein each component of the filler composition has a largest dimension of less than the thickness of the foam, the filler composition comprising a particulate ceramic filler, a particulate calcium carbonate filler, or a particulate aluminosilicate clay filler having a plate morphology, or a particulate aluminosilicate clay filler having a hollow tubular morphology, a particulate polymeric silsesquioxane filler, or a particulate methyl-phenyl MQ filler, or a plurality of glass microspheres, or a particulate paraffin wax, or a combination thereof; wherein the curable filled composition has a viscosity of less than 400,000 centiStokes, or 100,000 to 350,000 centiStokes.