Cured silicone rubbers for acoustic damping, and formulations and methods used to make the same, are provided.

A composition contains (a) a silicon-free mercapto compound comprising 2 or more mercapto groups; (b) a linear polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group, 40 mole-percent or more phenyl groups relative to moles of silicon atoms and at least one alkoxysilyl group per molecule; (c) a resinous polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group and 20 mole-percent or more phenyl groups relative to moles of silicon atoms; (d) a photoinitiator; and (e) a moisture cure catalyst; and wherein the molar ratio of mercapto groups to terminally unsaturated alkenyl groups in the composition is in a range of 0.3 to 2.0.

A two-part RTV silicone is shown and described herein. In one aspect, provided is an electrostatically dissipative, two-part RTV silicone material. In embodiments, the silicone is white and exhibits a low thermal conductivity.

Branched SiOC-linked polyethersiloxanes have the following formula (I) ##STR00001##
where R.sup.1 is an alkyl radical having 1 to 4 carbon atoms or a phenyl radical, but preferably 90% of the radicals R.sup.1 are methyl radicals; b has a value of from 1 to 10; a has a value of from 1 to 200, preferably 10 to 100, a value of from 3 to 70 when b is ≥1 and ≤4, or a value of from 3 to 30 when b is >4; and R.sup.2 denotes identical or different polyether radicals, but at least one radical R.sup.2 is a structural element radical of formula (II): ##STR00002##
where p=at least 2, preferably p=2-6, particularly preferably p=3.

A bio-electrode composition contains: (A) a polymer compound containing a repeating unit-a having a structure selected from the group consisting of salts of ammonium, sodium, potassium, and silver formed with any of fluorosulfonic acid, fluorosulfonimide, and N-carbonyl-fluorosulfonamide; and (B) a silicone compound having a polyglycerin structure. This bio-electrode composition is able to form a living body contact layer for a bio-electrode which enable quick signal collection after attachment to skin.

Provided is a fluorosilicone resin and a preparation method thereof. Using pentafluorostyrene as raw material, pentafluorophenethyldimethylchlorosilane is prepared by a hydrosilylation reaction. By means of a polycondensation reaction of the pentafluorophenethyldimethylchlorosilane, trimethylchlorosilane and tetraethyl orthosilicate, a pentafluorophenyl silicone resin is prepared. The preparation method adopts a two-step polycondensation process, which overcomes the disadvantages of a large difference in hydrolysis reactivity between pentafluorophenyldimethylchlorosilane and a copolymerized trialkyl-chlorosilane, and achieves a high yield. The obtained pentafluorophenyl silicone resin has the advantages of superior heat resistance, simple preparation process, low equipment requirements, high availability of raw material, and suitability for mass production. The heat-resistant fluorosilicone resin can be applied in a polymer material, such as a heat-resistant adhesive.

This ultraviolet curable silicone adhesive composition that contains (A) an organopolysiloxane resin which contains (a) an R.sup.1.sub.3SiO.sub.1/2 unit (wherein R.sup.1 represents a monovalent hydrocarbon group) and (b) an SiO.sub.4/2 unit, and wherein the molar ratio of the unit (a) to the unit (b) is from 0.6:1 to 1.2:1, (B) a linear or branched organopolysiloxane which has a viscosity of more than 50 mPa.Math.s but 500,000 mPa.Math.s or less, while having 1-4 groups represented by formula (1) and/or (2) ##STR00001##
(wherein R.sup.2 represents H or Me, a represents a number of 1-3, and the broken line represents a bonding hand that is bonded with Si)
as Si-bonded groups, and wherein the main chain is composed of repeated diorganosiloxane units, and (C) a reactive diluent which is composed of an organo(poly)siloxane that has a viscosity of 1-50 mPa.Math.s, while having one group represented by formula (3) ##STR00002##
(wherein a is as defined above, and the broken line represents a bonding hand)
at an end of the molecular chain or in a molecular side chain as an Si-bonded group, is rapidly cured by means of irradiation of ultraviolet light, and exhibits good adhesion to a sheet-like substrate.

An object of the present invention is to provide a conductive silicone composition that is cured at a low temperature in a short time and from which a cured product having excellent conductivity can be obtained. A conductive silicone composition containing (A) to (E) components described below and containing greater than or equal to 10 parts by mass and less than 100 parts by mass of the (D) component with respect to 100 parts by mass of the (A) component: (A) component: a polyorganosiloxane having one or more alkenyl groups in a molecule (B) component: a compound having a hydrosilyl group (C) component: a hydrosilylation catalyst (D) component: a silane compound having an epoxy group and an alkoxysilyl group (E) component: a conductive powder.

Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.

A composition including a fluorine-containing polymer and a silicon-containing compound, wherein the phosphorus content in the composition is 20 ppm or less. Also disclosed is a molded article obtained from the composition, and a second composition containing a fluorine-containing polymer and a silicon-containing polymer, wherein a content of an amide solvent in the composition is less than 1000 ppm.