C08G77/00

Metal-containing resist underlayer film-forming composition containing polyacid

A resist underlayer film-forming composition including: (A) component: an isopoly or heteropoly acid, or a salt thereof, or a combination thereof; and (B) component: polysiloxan, poly hafnium oxide or zirconium oxide, or a combination thereof, wherein an amount of the (A) component is 0.1 to 85% by mass of a total amount of the (A) component and the (B) component; and polysiloxan is a hydrolysis-condensation product of hydrolyzable silane of Formula (1):
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b)  Formula (1)
and a hydrolyzable silane whose (a+b) is 0 is contained in a proportion of 60 to 85 mol % of a total hydrolyzable silane in Formula (1); the poly hafnium oxide is a hydrolysis-condensation product of hydrolyzable hafnium of Formula (2):
Hf(R.sup.4).sub.4  Formula (2)
and the zirconium oxide is a hydrolysis-condensation product of hydrolyzable zirconium of Formula (3) or Formula (4):
Zr(R.sup.5).sub.4  Formula (3)
ZrO(R.sup.6).sub.2  Formula (4)
or a hydrolysis-condensation product of a combination thereof.

Curable resin composition, cured product thereof, and semiconductor device using the same

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Polyamide terpolymers for manufacture of transparent articles

Amorphous polyamide terpolymers with a high level of transparency, transition glass temperature, flexibility, and chemical resistance. In one embodiment, the polyamide terpolymers are polymerized from caprolactam, at least one diamine, and at least one diacid.

Addition-curable silicone resin composition and a semiconductor device
11208532 · 2021-12-28 · ·

An addition-curable silicone resin composition which exhibits good adhesion to a substrate and has good compatibility with an inorganic filler, as well as a cured product thereof and a highly reliable semiconductor device encapsulated with the cured product, are provided. The addition-curable silicone resin composition includes (A) a linear or branched organopolysiloxane having at least one alkenyl group, said organopolysiloxane comprising at least one unit selected from R.sup.1R.sup.2SiO.sub.2/2 and R.sup.1R.sup.2.sub.2SiO.sub.1/2 units, and at least one unit selected from R.sup.2′.sub.2SiO.sub.2/2, R.sup.2′.sub.3SiO.sub.1/2 and R.sup.2′SiO.sub.3/2 units, wherein a percentage of a total number of the R.sup.1R.sup.2SiO.sub.2/2 and R.sup.1R.sup.2.sub.2SiO.sub.1/2 units, relative to a total number of all siloxane units, is from 0.001% to 50%, and wherein R.sup.1 is, independently at each occurrence, a hydroxy group or an alkoxy group of 1 to 30 carbon atoms; R.sup.2 is, independently at each occurrence, a group selected from a substituted or unsubstituted saturated hydrocarbon group of 1 to 12 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group of 6 to 12 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, and the groups as defined for R.sup.1; and R.sup.2′ is a groups selected from the groups as defined for R.sup.2 other than those as defined for R.sup.1, with the proviso that at least one of R.sup.2 and R.sup.2′ is an alkenyl group; (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups, in an amount such that the ratio of the number of hydrosilyl groups in component (B) to a total number of alkenyl groups in component (A) is from 0.1 to 4; and (C) a catalytic amount of a hydrosilylation catalyst.

TONER

A toner comprising a toner particle and an external additive, wherein the external additive comprises a composite particle comprising an organosilicon polymer fine particle covering a surface of an alumina particle, a coverage ratio of the surface of the alumina particle with the organosilicon polymer fine particle is 1 to 50 area %, and given A (nm) as a number-average particle diameter of primary particles of the organosilicon polymer fine particle and B (nm) as a number-average particle diameter of primary particles of the alumina particle, following formulae (I) and (II) are satisfied:


A≤90  (I)


100≤B≤1000  (II).

Method for continuously producing low-alkoxy branched siloxanes
11203606 · 2021-12-21 · ·

Branched organopolysiloxanes and organopolysiloxanes with low alkoxy content are produced in a first reaction unit by continuous feed of organohalosilanes and alcohol to a reaction vessel surmounted by a distillation column, the vessel containing an excess of water relative to the halogen content of the organohalosilanes. A second reaction unit for removing volatiles from the product from the first reaction unit is also preferably employed.

ADHESIVE
20210380856 · 2021-12-09 ·

Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.

ELECTRONIC DEVICE COMPRISING A CONFORMAL VISCOELASTIC OR NON-NEWTONIAN COATING

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC.
20210371659 · 2021-12-02 ·

A curable organopolysiloxane composition having rheological properties suitable for precision application and fine pattern formation by a fine droplet coating apparatus such as a jet dispenser, along with a method for forming a pattern using the same, and an electronic component using the same, is provided herein. The curable organopolysiloxane composition is hydrosilylation reaction curable and can be precisely applied by a jet dispenser, etc. The composition has a viscosity at a strain speed of 1,000 (1/s) of 2.0 Pa.Math.s or less, while the viscosity at a strain speed of 0.1 (1/s) is a value 50.0-fold or more the viscosity at a strain speed of 1,000 (1/s). The content of silicon atom-bonded aromatic functional groups in the composition is within a range of from 1.0 to 6.0 mass %.

SILICONE-BASED ADHESIVE PROTECTION FILM AND OPTICAL MEMBER COMPRISING SAME
20220206190 · 2022-06-30 ·

Provided are a silicone-based adhesive protection film and an optical member comprising same, the protection film being formed of a composition comprising an alkenyl group-containing organic polysiloxane, an organic polysiloxane resin, a siloxane-based ionic compound, a cross-linking agent, and a hydrosilylation catalyst, wherein the organic polysiloxane resin includes an organic polysiloxane resin comprising a R.sup.1R.sup.2R.sup.3SiO.sub.1/2 unit (R.sup.1, R.sup.2, and R.sup.3 are each independently an alkyl group having 1 to 6 carbon atoms) and a SiO.sub.4/2 unit.