The invention pertains to a process for manufacturing a thermoset polymer foam, comprising the steps ofsubjecting a reaction mixture comprising surfactant and a prepolymer to an agitation step, the prepolymer being obtained by polymerisation of a combination of polyol monomers and polycarboxylic acid monomers, of hydroxycarboxylic acid monomers, or of a combination of polyol monomers and polycarboxylic acid monomers and hydroxy carboxylic acid monomers, the prepolymer having an extent of polymerisation between 0.1 and 0.8, andsubjecting the reaction mixture thus obtained to a curing step in the absence of agitation, to obtain a thermoset polymer foam, wherein the surfactant comprises an ampholytic surfactant, the total surfactant concentration being in the range of 0.1-6 wt. %. A thermoset polymer foam comprising a polymer obtained by polymerisation of a combination of polyol monomers and polycarboxylic acid monomers, of hydroxycarboxylic acid monomers, or of a combination of polyol monomers and polycarboxylic acid monomers and hydroxy carboxylic acid monomers, and an ampholytic surfactant, the total surfactant concentration being in the range of 0.1-6 wt. %, the polymer having an extent of polymerisation of at least 0.8 and a density of at most 850 gram/liter is also claimed.

The embodiment relates to a polishing pad that comprises a polishing layer. When pyrolysis oil obtained from the polishing pad is analyzed according to the KS M 2457 standard, the content of chlorine components is 13,000 mg/kg or more. The pyrolysis oil can be used as a high-quality heat source through a refining process. Accordingly, the embodiment can contribute to improving environmental problems while increasing the recycling rate of polishing pads.

Polymeric microspheres may be included in polyisocyanurate/polyurethane foam compositions. An exothermic foaming process and/or the application of heat during the foaming process may cause the polymeric microspheres to expand in diameter. The expanded polymeric microspheres may improve the structural properties and/or the insulating properties (e.g., R-value) of the resultant foamed PIR/PUR composition, especially an open-cell structure.

The embodiment relates to a polishing pad for use in a chemical mechanical planarization process of semiconductor devices. The polishing pad comprises a top pad layer, wherein the polishing pad has a total biomass content of 1 to 50% by weight as measured according to the ASTM D 6866 standard; thus, it can be environmentally friendly.

The present invention relates to a cosmetic comprising polyurethane foam in which a liquid cosmetic substance is impregnated. The present invention provides a cosmetic comprising polyurethane foam in which a cosmetic composition is impregnated, wherein the 5 polyurethane of the polyurethane foam comprises an ether group and an ester group in a molar ratio of 4:6 to 6:4, the-<cosmetic composition has a water content of 35 wt % or less, and the threshold shear stress at which storage modulus (G)=loss modulus (G) is 100 Pa or less. According to the present invention, provided is a cosmetic comprising a composite polyurethane foam, wherein a cosmetic composition is stably present in a supported state and 10 can be uniformly rearranged inside the foam during pressurization.

The composition according to an embodiment employs a mixture of curing agents, which comprises a first curing agent containing sulfur and a second curing agent containing an ester group, whereby it is possible to control the physical properties of the polishing pad as necessary.

A polyalkylene ether glycol composition including a polyalkylene ether glycol including an alkoxy group serving as a terminal group. The polyalkylene ether glycol composition has a hydroxyl value of 220 or more and 750 or less. The ratio of the number of alkoxy group terminals of the polyalkylene ether glycol included in the polyalkylene ether glycol composition to the number of hydroxyl group terminals of polyalkylene ether glycols included in the polyalkylene ether glycol composition is 0.00001 or more and 0.0040 or less. Provided is a polyalkylene ether glycol composition having excellent compatibility with low-molecular-weight polyols, having suitable reactivity when used as a raw material for polyurethanes, and capable of achieving intended physical properties.

Disclosed is a tire with reduced cavity noise including an adhesive agent layer applied to an inside an inner liner, and a sound absorber layer attached to the adhesive agent layer, wherein the adhesive agent layer includes polyether containing an alkoxysilane substituent group in a main chain, rather than, at an end. The tire with reduced cavity noise is stable without causing separation of a sound absorber even heating and deformation during driving.

A polyol resin blend suitable for rigid foam applications having one or more active hydroxyl compounds, a silicone surfactant, a halogenated olefinic blowing agent, and an amine catalyst. The polyol resin blend can include from about 0.3% to about 7% by weight amine catalyst. The polyol resin blend may be used to form a polyurethane and/or polyisocyanurate foam.

This disclosure provides methods for the chemical modification of microbial derived triglyceride oils, use thereof in polyurethane chemistries, and incorporation thereof as a core material alone or as part of a wood core composite in the production of sporting goods equipment, including, for example, alpine skis, touring skis, cross country skis, approach skis, split boards, snowboards, and water skis.