C08G2120/00

NOVEL COMPOSITIONS FOR POLYURETHANE APPLICATIONS

A process comprising, consisting of, or consisting essentially of: forming a reaction mixture containing at least one polyisocyanate and an isocyanate-reactive compound comprising at least one alkoxylated triazine-arylhydroxy-aldehyde condensate composition wherein the alkoxylated triazine-arylhydroxy-aldehyde condensate composition is a reaction product of a triazine-arylhydroxy-aldehyde condensate and at least one alkylene carbonate, is disclosed.

PRODUCTION METHOD OF THERMOPLASTIC AROMATIC POLYESTER RESIN COMPOSITION
20200010668 · 2020-01-09 · ·

A manufacturing method for a thermoplastic aromatic polyester resin composition is disclosed having a step of blending: a thermoplastic aromatic polyester resin A; an alkali composition B containing a thermoplastic aromatic polyester resin a and an alkali compound b; and a carbodiimide compound C. The alkali composition B is preferably a composition in which an aqueous solution of the alkali compound b is melt-kneaded with the thermoplastic aromatic polyester resin a. The carbodiimide compound C preferably contains an aromatic carbodiimide compound. The alkali compound U content in the thermoplastic aromatic polyester resin composition is preferably 10 ppm by mass or more and 100 ppm by mass or less.

Method for producing cured product of episulfide-based resin

The present invention can provide a method for producing a cured product of an episulfide-based resin, the method having: (A) a step for obtaining a composition for a resin by mixing compound (a), compound (b) and a polymerization catalyst; (B) a step for pouring the composition for a resin into a mold; and (C) a step in which, by increasing the temperature of a heating medium, the composition for a resin is polymerized in the heating medium that contains a liquid having a thermal conductivity of 0.2 W/m.Math.K or higher, or in a shower of the heating medium. The maximum temperature of the heating medium in step (C) is 55 to 110 C. (a) A compound which has two episulfide groups per molecule and which is represented by formula (1): ##STR00001##
wherein m represents an integer from 0 to 4 and n represents an integer from 0 to 2 (b) A compound having one or more thiol groups per molecule.

Process for producing polymerizable composition for optical material and polymerizable composition for optical material

A process for producing a polymerizable composition for an optical material of the present invention includes a step of mixing (A) at least one kind of thiol compound having at least two mercapto groups, (B) a tin compound represented by general formula (1), and (C) at least one kind of isocyanate compound having at least two isocyanato groups, in which the polymerizable composition for an optical material obtained in the above step has a haze value of 0.05 or less.
(R.sup.4).sub.cSnX.sub.4-c(1)

MOULDING COMPOSITIONS BASED ON POLYAMIDE, GLASS FIBRES AND HOLLOW GLASS REINFORCEMENT AND USE THEREOF
20240101820 · 2024-03-28 · ·

The present invention relates to a molding composition, comprising by weight: (A) 38 to 87% of at least one semi-crystalline aliphatic polyamide, (B) 3 to 25% of a hollow glass reinforcement, (C) 5% to 30% glass fibers, (D) 5 to 15% of at least one impact modifier chosen from a polyolefin, a polyether block amide (PEBA-1) and a mixture thereof, the polyolefin and the PEBA-1 having a flexural modulus less than 200 MPa, in particular less than 100 MPa, as measured according to standard ISO 178:2010, at 23? C., (E) 0 to 2% by weight of at least one additive, the sum of the proportions of each constituent of said composition being equal to 100%, the density of the composition being less than 1.12 g/cm3.

Composite structure
11919273 · 2024-03-05 · ·

A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.

CURABLE COMPOUND PRODUCT
20240067777 · 2024-02-29 · ·

The present invention provides a curable compound product that forms a cured product having excellent heat resistance and high insulating properties by performing heat treatment. The curable compound product of the present disclosure contains a compound represented by Formula (1) below, and a proportion of a group represented by Formula (r-1) below to the sum of the group represented by Formula (r-1) below and a group represented by Formula (r-2) below is 97% or greater. In Formula (1), R.sup.1 and R.sup.2 are identical or different, and each represent the group represented by Formula (r-1) the group represented by Formula (r-2) below: D.sup.1 and D.sup.2 are identical or different, and each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below.

##STR00001##

Bifuran polyesters

Semicrystalline polyethylene-2,2-bifuran-5,5-dicarboxylate (PEBF) homopolyester or copolyester with up to 5 mole percent isophthalate or up to 2.7 mole percent terephthalate, based on the diacid component, or up to 2.5 mole percent 1,4-cyclohexanedimethanol (CHDM), based on the diol component, prepared by esterifying or transesterifying the diacid and the diol components with a catalyst including about 10 to about 50 ppm wt metal, and polycondensation, wherein the bifuran polyester has an intrinsic viscosity of at least 0.4 g/dL and a semicrystalline melting peak (Tm) with Hf equal to or greater than 5 J/g on the second heating ramp.

POLYAMIDE COMPOSITION AND ARTICLE MADE THEREFROM WITH IMPROVED MOLD SHRINKAGE
20240052101 · 2024-02-15 ·

Described herein is a polyamide composition comprising two polyamides and glass fiber, wherein one of the polyamides is a polyphthalamide formed by polycondensation from various monomers: dicarboxylic acid(s) with diamine(s) and/or amino acid(s), wherein at least one monomer contains a cyclohexyl group. It was surprisingly discovered that the polyamide composition has improved warpage and/or mold shrinkage properties, excellent mechanical performance and high Tg and/or Tm. Due to the excellent performance, the polyamide composition is suitable for molding and can be desirably incorporated into mobile electronic device applications.

METHOD OF PRODUCING OPTICAL MATERIAL, POLYMERIZABLE COMPOSITION FOR OPTICAL MATERIAL, AND OPTICAL MATERIAL
20240052086 · 2024-02-15 · ·

A method of producing an optical material, which comprises a step of preparing a polymerizable composition containing a polythiol composition and a polyiso(thio)cyanate compound; a determination step which comprises measuring a content of a solvent A which is at least one selected from the group consisting of toluene, acetone, and N,N-dimethylformamide, in the polymerizable composition to check whether the content of the solvent A is within a range of from 0.10% by mass to 1.70% by mass, and, in a case in which the content of the solvent A is within a range of from 0.10% by mass to 1.70% by mass, determining the polymerizable composition as a polymerizable composition for an optical material; and a step of injecting the polymerizable composition for an optical material into a mold for resin molding and curing the same, thereby obtaining an optical material as a resin-molded product.