A multiple-part curable composition, a cured composition formed by combining and reacting the multiple-part curable composition, and a method of providing a cured composition are described. The multiple-part curable composition contains at least a part A and a part B. Part A contains an oxalamido-containing compound while part B contains a derivatized polyethylene imine. The cured composition is an adhesive that is suitable for use as a tissue adhesive.

An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Disclosed is an adhesive formulation that, when stimulated by a defeatable stimulation, reduces an adhesive bonding force of the adhesive formulation and defeats the adhesive formulation. The adhesive formulation having (i) programmable linkages made from Diels-Alder adducts and (ii) a concentration of diene traps. The Diels-Alder adducts may be furan-maleimide, and the diene traps may be (i) latent alkenes and (ii) selected from functional groups that will create irreversible reations with furan. The adhesive formulation may be capable of being applied as a coating, and the adhesive formulation may be capable of being extruded. The adhesive formulation may have a bonding temperature between 75 and 120° C. And the defeatable stimulation could, for example, be a temperature above 130° C. The adhesive formulation also may contain several types of programmable linkages and diene traps.

An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
E1-(M1).sub.a1-(L1).sub.b1-(M2).sub.a2-L2-A1-L3-(M3).sub.a3-(L4).sub.b2-(M4).sub.a4-E2  Formula 1
E3-(A2).sub.c1-(L5).sub.b3-(M5).sub.a5-L6-(M6).sub.a6-L7-(M7).sub.a7-(L8).sub.b4-(A3).sub.c2-E4  Formula 2 In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

Provided is a resin composition comprises a cyanate ester compound (A), an amine adduct compound (B) and a borate ester (C).

A heat stable siloxane-imide copolymer and a curable silicone adhesive composition comprising such a siloxane-imide copolymer is shown and described herein. The composition includes an alkenyl silicone, a silicone hydride based cross linker, hydrosilylation catalyst and additives that is curable at relatively low temperatures and shows good heat stability.

A condensation curable silicone adhesive composition comprising a siloxane-imide base polymer, condensation curable organopolysiloxane crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability.

The invention relates to a composition comprising and to a process for preparing moisture-crosslinking polymers under catalysis by a metal-siloxane-silanol(ate) compound, and to the use of the composition in the CASE sector (coatings, adhesives, sealants and elastomers), especially in the field of adhesives and sealants.

A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time. The thermosetting conductive adhesive according to the present invention includes components (A) to (D): component (A): a urethane-modified polyfunctional (meth)acrylate oligomer that is either an aromatic urethane-modified (meth)acrylate oligomer having six (meth)acryl groups in the molecule or an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule; component (B): a monofunctional (meth)acrylate monomer; component (C): an organic peroxide; and component (D): conductive particles, in which when the component (A) is an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule, the component (B) is a monofunctional acrylate monomer.

Provided is a urea compound-containing epoxy resin curing agent particle that can impart excellent storage stability and heat stability to an epoxy resin composition including a urea compound as a curing agent, while maintaining the solubility of the urea compound during heating and the fluidity after dissolution of the urea compound. The surface of the urea compound-containing epoxy resin curing agent particle is coated with a Group 4 or Group 13 element-containing alkoxide compound, chelate compound, and/or acylate compound.