A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed, as well as methods of forming the same. The photocurable silicone composition comprises: (A) a specific organopolysiloxane having alkenyl groups in a molecule; (B) a compound having at least two thiol groups in a molecule; (C) a photoradical initiator having a phosphorus atom; and (D) a specific hydroxyphenyl triazine compound. The composition exhibits excellent curability by LED lamp with wide UV-Visible range as well as metal-halide lamp, and cures to form a cure product exhibiting excellent resistance to light.

A urethane-based adhesive composition includes a urethane prepolymer, a carbon black A having a dibutyl phthalate oil absorption number of 30 to 40 ml/100 g, a carbon black B having a dibutyl phthalate oil absorption number of 98 to 108 ml/100 g, a calcium carbonate C, a plasticizer D, a modified product E of an aliphatic diisocyanate, and a catalyst, and the urethane-based adhesive composition is configured to satisfy all of the following (1) to (6): (1) 25≤a≤35, (2) 55≤b≤75, (3) 197≤a+3b≤251, (4) 30≤c≤35, (5) 35≤d≤45, and (6) 9≤e≤13.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

A poly(meth)acrylate urethane polymer, obtained from the reaction of at least one monomeric diisocyanate and a poly(meth)acrylate polyol having an OH number in the range from 50 to 200 mg KOH/g in an NCO/OH ratio of at least 3/1, followed by removal of a majority of the monomeric diisocyanate by means of a suitable separation method, wherein it has an NCO content in the range from 2.5% to 8% by weight, based on the poly(meth)acrylate urethane polymer, and a residual content of unconverted monomeric diisocyanates of not more than 0.5% by weight, and to the use thereof as additive and to moisture-curing polyurethane compositions.

A water soluble biocompatible adhesive is provided comprising one or more compounds of structure 1 wherein B is an oligomer derived from a polyether or polyalkylene glycol, with a MW<5,000 g/mol, Linker L is a urethane, urea bond, or amide bond; Linker L′ is a urethane or urea bond, A is a chain extender of Mw≤3000 g/mol comprising substituted or unsubstituted alkyl, cycloalkyl and/or aromatic groups, W is a terminal adhesive benzene-1,2-diol derivative or a terminal adhesive benzene-1,2,3-diol derivative, m is 0 or 1; and n is 0, 1, 2, 3 or 4. The compound(s) have a Tg lower than 25° C. The biocompatible adhesive is suitable for use without solvent.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.

Provided are a photocurable fluoropolyether-based elastomer composition having both a favorable preservation stability and fast curability, being bondable at a low temperature in a short period of time, and generating no air bubbles in the resin at the time of curing; and a bonding method thereof. The photocurable fluoropolyether-based elastomer composition contains: (A) a linear polyfluoro compound; (B) a fluorine-containing organohydrogenpolysiloxane; (C) a photoactive hydrosilylation reaction catalyst; and (D) a zeolite having an average primary particle size of not larger than 30 μm.

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and an inorganic filler. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The present disclosure also provides a two-part composition, in which the polymeric material is included in the first part and the second part includes at least one amine. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymerized product of the two-part composition and a battery module. Advantageously, two-part compositions can be used as coatings and adhesive systems including high loadings of inorganic filler, such as thermally conductive filler, with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

1) Ionic silylated copolyurethane of formula:

##STR00001##

in which R.sup.1 is a hydrocarbon radical; R.sup.2 is a C2-C4 alkylene; n is an integer such that the molecular mass of —[OR.sup.2].sub.n is 2500-20 000 g/mol; R.sup.∘ is H or C1-C18 alkyl; R, R′ and R″ are a hydrocarbon-based radical; x and y are integers from 1 à 8; z is an integer from 0 to 8; m and q are an integer of greater than or equal to 1, such that q/m ranges from 0.04 to 20; F.sup.1 is a radical of formula (IIa) and F.sup.2 is a radical of formula (IIb):

##STR00002## in which R.sup.3 is methylene or n-propylene; R.sup.4 and R.sup.5 are methyl or ethyl; p is equal to 0 or 1; R.sup.6 is a C1-C4 alkyl.

2) Process for preparing copolyurethane 1), comprising: (i) polyaddition between a polyisocyanate, a polyether diol and a carboxylic diol; (ii) neutralization of the product formed with the amine N(R)(R′)(R″); then (iii) reaction with an aminosilane derived from a secondary amine.

3) Composition, usable as sealant and/or adhesive, comprising copolyurethane 1) and a filler.