The present invention provides curable, high molecular weight (>20,000 Daltons) polyimide compounds. The polyimides, once cured, possess a wide range of glass transition temperatures, have high tensile strength and high elongation. Furthermore, the cured polyimides are hydrophobic, have high glass transition temperatures, low coefficient of thermal expansion, very low dielectric constant and very low dielectric dissipation factor.

The present disclosure provides a two-component solventless adhesive composition comprising a polyol component and an isocyanate component. The polyol component comprises a phosphate functional compound, and at least one polyol selected from polyester, polyether, and the combination thereof; and the isocyanate component comprises isocyanate prepolymer that is the reaction product of at least one isocyanate monomer and at least one polyol selected from polyester, polyether, and the combination thereof.

A two-component polyurethane adhesive including a polyol component K1 and a polyisocyanate component K2; wherein the polyol component K1 includes at least one diol A1 having two primary hydroxyl groups and a molecular weight in the range from 60 to 150 g/mol, at least one triol A2 having an average molecular weight in the range from 1,000 to 10,000 g/mol, at least one polyester polyol A3 based on dimer fatty acids and/or dimer fatty alcohols, especially based on dimer fatty acids; and the polyisocyanate component K2 includes at least one polyisocyanate B1 and/or at least one polyurethane polymer B2 having isocyanate groups.

Provided herein is a process for preparing a heterocycle-functional polyoxyalkylene polyol, in which a polyoxyalkylene polyol having unsaturated groups is reacted with a heterocyclic compound. Also provided herein is a heterocycle-functional polyoxyalkylene polyol, a method of crosslinking a heterocycle-functional polyoxyalkylene polyol, a crosslinked, heterocycle-functional polyoxyalkylene polyol, and related processes.

The present invention refers to polyurethane adhesives with semi-crystalline and highly crystalline polyesters, a method for the production of the same as well as the use of the polyurethane adhesive in the production of electronic devices.

The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a special capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.

The invention relates to a curable two- or multi-part composition with (a) optionally an at least bifunctional epoxy-containing compound; (b) an at least bifunctional nitrogen-based curing agent suitable for epoxy curing; (c) a radiation-curable hybrid compound having both one or more radiation-curable methacrylate groups and one or more epoxy groups; (d) a radical photoinitiator; (e) optionally an accelerator for epoxy curing, and (f) optionally further additives. In addition, the invention relates to a method for the bonding, casting, molding or coating of substrates using the composition.

The invention relates to a curable composition comprising: a) at least one polymer having at least one silicon-containing group of formula —Si(R.sup.1).sub.k(Y).sub.3-k as defined herein, and b) at least one hydroxyl-functionalized polysiloxane polyalkyleneglycol brush copolymer of the structure [A(-X—B)].sub.s as defined herein; and an adhesive, sealant, or coating material comprising said curable composition and use thereof.

A polyurethane—polyorganosiloxane copolymer and methods for its preparation are disclosed. The copolymer has polyfunctional end groups, which render it crosslinkable by multiple crosslinking reactions.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.