Patent classifications
C08G2250/00
REACTIVE HOT-MELT ADHESIVE COMPOSITION CONTAINING A POLYESTER-POLYURETHANE
A reactive hot-melt adhesive composition is provided which is the product of a reaction mixture comprising a polyester-polyurethane intermediate, optionally crystalline and/or amorphous polyesters or polyethers, and an excess of isocyanate groups. The inclusion of the polyester-polyurethane intermediate in the reactive hot-melt adhesive composition allows the properties of the adhesive composition to be customized for various applications.
PROCESS FOR MANUFACTURING POLYESTER RESINS
The present invention is directed at a process for crystallizing non-solid state polymerized polyester resins to improve the extrusion of such resins to manufacture articles using standard screws designed for solid state polymerized resins, and to reduce the amount of oligomers in such articles. The non-solid state polyester polymerization polyester process which includes a final crystallizer process that does not increase the IV of the resin by more than about 0.02 dl/g.
Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, and production method for cured epoxy resin
A production method for a glassy liquid-crystalline epoxy resin, comprising a process of cooling a liquid-crystalline epoxy resin to cause transition into a glassy state.
PROCESS FOR THE PRODUCTION OF A SOLID-STATE POLYMERIZED POLY (TETRAMETHYLENE-2, 5-FURAN DICARBOXYLATE) POLYMER AND POLYMER THUS PRODUCED
A solid-state polymerized poly(tetramethylene-2,5-furandicarboxylate) polymer is produced in a process including: providing a poly (tetramethylene-2,5-furandicarboxylate) polycondensate having a number average molecular weight (Mn) of at least 10,000, as determined by Gel Permeation Chromatography (GPC) using polystyrene as standard, and having a content of carboxylic acid end groups of at most 50 meq/kg; and keeping the poly(tetramethylene-2,5-furandicarboxylate) polycondensate at a temperature in the range of 80 to 140 C. to obtain a semi-crystalline polycondensate; and subjecting the semi-crystalline polycondensate to solid-state polymerization by keeping the semi-crystalline polycondensate at a temperature of at least 140 C. and below its melting point, whilst the semi-crystalline polycondensate is either under a flow of inert gas or under vacuum to obtain the solid-state polymerized poly(tetramethylene-2,5-furandicarboxylate) polymer.
Liquid crystal polymer film and laminate comprising the same
Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.
Bifuran polyesters
Semicrystalline polyethylene-2,2-bifuran-5,5-dicarboxylate (PEBF) homopolyester or copolyester with up to 5 mole percent isophthalate or up to 2.7 mole percent terephthalate, based on the diacid component, or up to 2.5 mole percent 1,4-cyclohexanedimethanol (CHDM), based on the diol component, prepared by esterifying or transesterifying the diacid and the diol components with a catalyst including about 10 to about 50 ppm wt metal, and polycondensation, wherein the bifuran polyester has an intrinsic viscosity of at least 0.4 g/dL and a semicrystalline melting peak (Tm) with Hf equal to or greater than 5 J/g on the second heating ramp.
Circuit board for use at 5G frequencies
A laminate for use in a circuit board is provided. The laminate comprises a conductive layer and a film positioned adjacent to the conductive layer. The film comprises a polymer composition that includes a liquid crystalline polymer and a hydrophobic material. The polymer composition exhibits a dielectric constant of about 5 or less and dissipation factor of about 0.05 or less at a frequency of 10 GHz.
Polymer composition for laser direct structuring
A laser activatable polymer composition is provided. The composition contains at least one laser activatable additive and at least one high naphthenic thermotropic liquid crystalline polymer that contains repeating units derived from naphthenic hydroxycarboxylic and/or dicarboxylic acids in an amount of about 10 mol. % or more. The polymer composition exhibits a dielectric constant of about 5 or less as determined at a frequency of 2 GHz.
Liquid crystal polymer film and laminate comprising the same
Provided are an LCP film and a laminate comprising the same. The LCP film is made of an LCP resin comprising a structural unit represented by Formula (1): -L.sub.1-Ar-L.sub.2- (1), wherein -L.sub.1- and -L.sub.2- are respectively O or CO; Ar is an arylene group. Formula (1) comprises structural units ##STR00001##
Based on a total molar number of the structural unit represented by Formula (1), a molar number of the structural unit represented by Formula (I) is in the range from 15 mole % to mole %, and a sum of molar numbers of the structural units represented by Formulae (I) and (II) is in the range from 80 mole % to 100 mole %. The LCP film has a thickness and a transmittance, wherein when values of the thickness (in ?m) and the transmittance are put into Formula (III), the obtained value is from 0.055 to 0.090. Formula (III): Log(1/TT %)/(Thickness).sup.0.5.
PRODUCTION METHODS FOR GLASSY LIQUID-CRYSTALLINE EPOXY RESIN AND GLASSY LIQUID-CRYSTALLINE EPOXY RESIN COMPOSITION, STORAGE METHODS FOR LIQUID-CRYSTALLINE EPOXY RESIN AND LIQUID-CRYSTALLINE EPOXY RESIN COMPOSITION, GLASSY LIQUID-CRYSTALLINE EPOXY RESIN AND GLASSY LIQUID-CRYSTALLINE EPOXY RESIN COMPOSITION, LIQUID-CRYSTALLINE EPOXY RESIN AND LIQUID-CRYSTALLINE EPOXY RESIN COMPOSITION, AND PRODUCTION METHOD FOR CURED EPOXY RESIN
A production method for a glassy liquid-crystalline epoxy resin, comprising a process of cooling a liquid-crystalline epoxy resin to cause transition into a glassy state.