A semicrystalline polyarylethersulfone (PAES) useful for additive manufacturing may be made by a method comprising: dissolving an amorphous polyarylethersulfone in a polar aprotic halogenated hydrocarbon solvent at a temperature adequate to effectively form a solution, and subsequently and spontaneously bring about reprecipitation of a semicrystalline polyarylethersulfone from the solution. The semicrystalline polyarylethersulfone may have a crystallinity of at least 30% by weight. The semicrystalline PAES, upon being heated, melting and uniting together in layers during additive manufacturing cools without substantially recrystallizing, allows for deformation-free articles to be formed having low residual stress.

A polymer composition for use in an electric circuit protection device is provided. The polymer composition comprises a polymer matrix that includes a thermotropic liquid crystalline polymer. The polymer composition exhibits an in-plane thermal conductivity of about 3.5 W/m-K or more as determined in accordance with ASTM E1461-13 and a melt viscosity of from about 1 to about 100 Pa-s as determined in accordance with ISO Test No. 11443:2014 at a temperature 15° C. higher than the melting temperature.

The present disclosure provides a crystalline polythiocarbonate and a preparation method thereof. The crystalline polythiocarbonate is a random copolymer and includes five structural units L1 to L5 as shown in the following formula. The method includes carrying out a polymerization reaction natively or in solution using carbon disulfide, ethylene oxide, selectively added third monomer, initiator, Lewis acid, selectively added chain transfer agent, and selectively added solvent as raw materials. This method provides a new way for high value-added application of carbon disulfide and ethylene oxide by using inexpensive carbon disulfide and ethylene oxide as monomers; the product is a random copolymerized crystalline polythiocarbonate with novel structure, which has various chain link structures and excellent mechanical properties, processing properties and degradability.

Provided is a liquid crystal polyester powder including a liquid crystal polyester having a number average molecular weight of 10000 or less, in which an average particle diameter of the liquid crystal polyester powder is 0.5 to 20 μm.

The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

The present disclosure relates to a polymer resin composition including a polyamide resin in which an average particle size of individual crystals measured by a small-angle X-ray scattering apparatus is reduced through an alternating segment structure, and at least one selected from the group consisting of a metal salt compound and an end-capping agent compound, and a polymer film and a resin laminate using the same.

The present disclosure discloses a liquid crystal polyester (LCP), an LCP composition, and use thereof. The LCP includes a repeating unit of formula (1), a repeating unit of formula (2), and a repeating unit of formula (3): (1) —O—Ar.sup.1—CO—, (2) —CO—Ar.sup.2—CO—, and (3) —O—Ar.sup.3—O—, where Ar.sup.1 is at least one selected from the group consisting of 2,6-naphthylene, 1,4-phenylene, and 4,4′-biphenylene; Ar.sup.2 is selected from the group consisting of 1,4-phenylene, 1,3-phenylene, and 4,4′-biphenylene; and Ar.sup.3 is selected from the group consisting of 2,6-naphthylene, 1,4-phenylene, 1,3-phenylene, and 4,4′-biphenylene; and the LCP has a melting enthalpy of over 1.5 J/g. The LCP and the composition including the LCP of the present disclosure have a high heat deflection temperature (HDT), and exhibit excellent heat resistance and anti-bubbling performance.

The invention relates to formulations of aqueous dispersion adhesives on the basis of aqueous polyurethane or polyurethane-urea dispersions and the use of the adhesive formulations for bonding foam substrates according to the spray coagulation method.

The invention relates to the use of aqueous dispersion adhesives on the basis of a mixture of aqueous polyurethane or polyurethane-urea dispersions for bonding foam substrates according to the spray coagulation method.

The present invention relates to a prepreg which contains an oriented liquid crystal polymer and a base that uses a continuous carbon fiber bundle as a forming material. The liquid crystal polymer is a thermotropic liquid crystal polymer and the base is included in an amount of at least 25 parts by mass but not more than 550 parts by mass per 100 parts by mass of the liquid crystal polymer.