Disclosed are a continuous manufacturing process for a rubber masterbatch and a rubber masterbatch prepared therefrom. The manufacturing process comprises: 1): a filler is added to a rubber solution, forming a rubber/filler/solvent mixture by stirring; 2): the rubber/filler/solvent mixture obtained in step 1) is fed into a coagulator, and is coagulated after optionally being brought into contact and mixed with one or more fluids of nitrogen, steam, water, aqueous slurry of filler, and oil in the coagulator, resulting in a mixture of a rubber/filler composite and a solvent; 3): the mixture obtained in step 2) is directly passed into a heating medium at a temperature higher than the boiling point of the solvent, the polarity of the medium being different from that of the solvent used, the mixture is coagulated and deswelled, and the solvent is evaporated rapidly, thereby forming a mixture of a rubber/filler composite and the solvent containing the heating medium; and 4): the solvent is removed and the remaining mixture is dried, resulting in a rubber/filler masterbatch.

Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

The present invention provides a highly dispersible metallic acrylate composition containing specific content of a graphene, a flake graphite or a combination thereof as a thermally conductive powder, and thus has better stability and dispersivity, which leads to advantages of low adhesion to the metal surface and ease of mixing in resin. Moreover, the metallic acrylate composition can be applied to resin composition as an auxiliary crosslinking coagent for enhancing mechanical strength and good uniformity of cell dispersion in the foamed product, such that the foamed products can be used as architectural materials, materials of daily commodities, vehicle materials, damping and cushioning materials, packing materials, sport pad materials, or shoe materials.

This polymer composition includes: a modified conjugated diene-based polymer having at least one nitrogen-containing functional group selected from the group consisting of a primary amino group, a secondary amino group, a tertiary amino group, a primary amino group having been protected or converted into an onium group, a secondary amino group having been protected or converted into an onium group, and a tertiary amino group having been converted into an onium group; and a functional-group-containing polymer having at least one functional group selected from the group consisting of an epoxy group, an acid anhydride structure, an oxazoline group, a hydroxyl group, a carboxyl group, and a sulfo group.

The invention relates to a new Acidithiobacillus ferrooxidans strain as well as a process for bacterially devulcanizing sulphur-vulcanized rubber particles and devulcanized rubber particles obtainable by said process.

Disclosed herein are processes for preparing a resin-extended rubber by mixing at least one thermoplastic resin with a resin-rubber-solvent cement comprising at least one conjugated diene monomer-containing rubber and the resin-extended rubber resulting from such processes. Also disclosed is a resin-extended rubber-solvent-cement comprising at least one conjugated diene monomer-containing rubber, at least one non-polar solvent, and at least one thermoplastic resin as well as a rubber composition comprising a resin-extended rubber.

A resin composition includes 100 parts by weight of a polybutadiene and 10 parts by weight to 40 parts by weight of a maleimide resin, wherein: the polybutadiene has a 1,2-vinyl content of greater than or equal to 85%; the polybutadiene has a lithium ion content of less than or equal to 100 ppm; and the resin composition is free from a polyphenylene ether resin. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Provided herein are ionically conductive solid-state compositions that include ionically conductive inorganic particles in a matrix of an organic material. The resulting composite material has high ionic conductivity and mechanical properties that facilitate processing. In particular embodiments, the ionically conductive solid-state compositions are compliant and may be cast as films. In some embodiments of the present invention, solid-state electrolytes including the ionically conductive solid-state compositions are provided. In some embodiments of the present invention, electrodes including the ionically conductive solid-state compositions are provided. The present invention further includes embodiments that are directed to methods of manufacturing the ionically conductive solid-state compositions and batteries incorporating the ionically conductive solid-state compositions.

A thermally expandable composition including at least one solid rubber R, at least on tackifying resin, at least one blowing agent, a vulcanization system, and 0.5-30 wt.-% of fibrous magnesium oxysulphate or carbon fibers or a mixture thereof. Also, a shaped article including a substrate layer composed of the thermally expandable composition, to a method for providing sealing, structural adhesion, baffling, or combination thereof to a structure of a manufactured article, and to use of fibrous magnesium oxysulphate or carbon fibers or a mixture thereof in a thermally expandable composition to improve sag resistance and/or flame resistance properties of said composition.

A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.