Provided is a resin additive masterbatch in which a low-melting-point resin additive is masterbatched and blocking is suppressed such that blocking does not occur even when the masterbatch is placed in an environment having large temperature fluctuations.

The resin additive masterbatch contains, with respect to 100 parts by mass of (A) a polyolefin resin: 60 to 150 parts by mass of (B) a resin additive having a melting point of 100 C. or lower; 0.01 to 3 parts by mass of (C) an organic acid metal salt; and 0.1 to 5 parts by mass of (D) a fatty acid metal salt.

A composition for a thermoplastic composite material including: a) from 65% to 95% by weight of at least one reactive semicrystalline polyamide prepolymer with an average molar mass Mn of less than 5000 g/mol and having a volume-mean diameter D50 of the reactive semicrystalline polyamide prepolymer powder particles ranging from 10 to 300 m, b) from 5% to 35% by weight of at least one flame retardant chosen from an at least partially meltable flame retardant in powder form and having a volume-mean diameter D50 of from 10 to 300 m, and a non-meltable flame retardant in premilled powder form with a volume-mean diameter D50 of from 1 to 50 m, and c) from 0 to 2% by weight of at least one additive, and said reactive polyamide prepolymer comprising or consisting of at least one Z/BACT/XT copolyamide.

A low-temperature curing adhesion promoter and primer for substrates is disclosed that combines a polyolefin with resins in a water-based coating or in dry-powder coating form. The water-based coating is prepared from mixing a dry solid-powder composition that includes the polyolefin and the resin(s) featuring a hardener/crosslinker with water. The water-based coating is applied to a substrate, such as thermoplastic olefins, to make the substrates conductive for electrostatic painting or further processing.

A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

The present invention relates to a plastic film obtained by (co)extrusion or by a multilayer extrusion process.

The purpose of the invention is to supply a plastic film having useful properties, in particular of thermal behaviour, adhesion, linear tearability, and having a reduced production cost.

This film contains lamellar particles based on at least one metal and/or at least one metal oxide. It is obtained by the extrusion of a raw material constituted entirely or partly by a ground material from at least one coated film comprising at least one polyester and/or polyolefin film and at least one coating film based on at least one metal and/or at least one metal oxide.

The invention also relates to a method of manufacture of the raw material of the plastic film according to the invention, a method of manufacture of said plastic film as well as the uses of said film.

Application in the field of packaging, decoration and heat treatments.

A composite film includes a composite blend layer including a water-soluble synthetic thermoplastic polymer and blocking particles, wherein the blocking particles are nanoclay particles or talc particles, and wherein the composite film is free of compatibilizers. In addition, a laminate film consists of two layers, wherein the first layer is a composite blend layer including polyvinyl alcohol (PVOH) and blocking particles, wherein the blocking particles are nanoclay particles or talc particles, and wherein the second layer is a polyolefin film layer in facing relationship with the composite blend layer, wherein the laminate is free of compatibilizers. These films can be used to manufacture a glove or other article for solvent resistance.

A carbon fiber bundle for resin reinforcement, wherein there are adhered by 0.1-5.0 mass % to a carbon fiber bundle in which multiple lengths of filament are bundled, a mixture created by mixing an organic polymer (A) having a mass-average molecular weight of 10000 or more and an organic compound (B) the thermal reduction rate specified in claim 1 of which is 5 mass % or more or an organic compound (B) the thermal reduction rate specified in claim 2 of which is 0.8 mass % or more, the amount of the organic polymer (A) adhered being 0.1 mass % or more.

A method for purifying a reclaimed polymer, such as a polymer reclaimed from post-consumer use or post-industrial use, is disclosed. The method involves obtaining the reclaimed polymer and dissolving it in a solvent at an elevated temperature and pressure to produce a polymer solution, which is purified at an elevated temperature and pressure by contacting the polymer solution with solid media to produce a purer polymer solution. A purer polymer is then separated from the purer polymer solution.

The disclosure relates to a method for modifying the rheology of a polymer and a polymeric composition obtained by the method. The composition comprises at least one organic peroxide and water in emulsion form. The polymer may comprise a polyolefin. The method comprises extruding a molten polymer and the composition and removing volatile compounds from the molten polymer.

The present invention provides a thermally expandable microcapsule from which a foam molded article that has a uniform surface, is less prone to surface unevenness, and has an excellently light weight can be produced. The present invention also provides a foamable masterbatch and a foam molded article each produced using the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell; and a volatile expansion agent as a core agent encapsulated by the shell, the thermally expandable microcapsule satisfying D10/D50 of 0.6 or more and 1.0 or less and D99/D50 of 1.0 or more and 2.0 or less where D10 represents a particle size at a cumulative frequency of 10% by volume, D50 represents a particle size at a cumulative frequency of 50% by volume, and D99 represents a particle size at a cumulative frequency of 99% by volume in a cumulative undersize distribution of a volume-equivalent particle size determined using a laser diffraction/scattering particle size distribution analyzer.