C08J2345/00

Barrier film for electronic devices

A barrier film for electronic devices exhibiting and maintaining excellent water barrier property. The barrier film for electronic devices features a water permeability (23° C., RH50%) that is set to be not more than 10.sup.−4 g/m.sup.2/day and a water content that is maintained to be not more than 2000 ppm.

Methods for preparing superhydrophobic nano-microscale patterned films

The present application discloses methods for preparing superhydrophobic nano-microscale patterned films, films pre-pared from such methods and uses of such films as superhydrophobic coatings. The superhydrophobic nano- microscale patterned films comprise high aspect ratio nanoparticles such as boron nitride nanotubes (BNNTs) and/or carbon nanotubes (CNTs).

Cycloolefin polymer bonding method

A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H.sub.2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.

Gels derived from poly(ethylidene norbornene)-b-poly(cyclopentene) block copolymer nanocomposites for viscosity modifications and drilling fluid applications

The present application is directed to a nanocomposite organo gel having a continuous polymeric network structure, wherein polymer chains are held together by ionic interaction between polymer chain ends, interparticle chain entanglements, layered silicate surface modifier, ionic salt, and layered silicate. The present application is also directed to methods of making and using the nanocomposite organo gel.

THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

Quantum-dot containing resin sheet or film, method for producing the same, and wavelength conversion member

To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.

Molding material and method for producing resin molded body using same

A molding material including a resin material that has a graft chain containing constituent units derived from a fluorine-containing compound and a non-fluorinated compound. The graft chain thereof may be formed, for example, using ionizing radiation.

RESIN SYRINGE, PREFILLED SYRINGE, AND METHOD FOR PRODUCING RESIN SYRINGE
20230201465 · 2023-06-29 · ·

A method for producing a resin syringe includes: a preparation step including: preparing a syringe body made of polyolefin, and preparing an ink comprising components including a volatile solvent that contains a dissolving component for dissolving the polyolefin, chlorinated polypropylene having a degree of chlorination in a range of 15 to 30%, a colorant, and a filler; an application step including applying the ink to at least a part of an outer surface of the syringe body, such that at least a part of the outer surface of the syringe body is dissolved by the dissolving component to form a plurality of recessed portions in the outer surface, each of the plurality of recessed portions is filled with at least one of the components of the ink; and a drying step including drying the applied ink to form a printing layer.

QUANTUM-DOT CONTAINING RESIN SHEET OR FILM, METHOD FOR PRODUCING THE SAME,AND WAVELENGTH CONVERSION MEMBER

To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.

OPTICAL FILM, METHOD OF MANUFACTURING THE OPTICAL FILM, POLARIZING PLATE USING THE OPTICAL FILM, AND IMAGE DISPLAY DEVICE

There is provided an optical film including: a layer A containing a cyclic olefin-based resin; and a layer B containing a cyclic olefin-based resin, and having a thickness thinner than a thickness of the layer A, wherein a glass transition temperature Tg[B] of the layer B is lower than a glass transition temperature Tg[A] of the layer A.