A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

The present invention relates to a method of producing a polymeric membrane having a homogeneous porosity throughout the entire polymeric phase. The method comprises the steps of dissolving at least one amphiphillic block copolymer in a solvent to form a casting solution of the block copolymer, and contacting the extruded solution with non-solvent to induce phase separation and thereby producing an integral asymmetric polymeric membrane, wherein the amphiphillic block copolymer is an amphiphillic diblock copolymer, containing blocks of a polar copolymer and blocks of a benzocyclobutene copolymer, and wherein the integral asymmetric polymeric membrane is crosslinked by application of heat or radiation thereby producing a membrane having a homogeneous porosity throughout the entire polymeric phase.

A production method for a branched conjugated diene-based polymer, comprising: a polymerizing step of obtaining a conjugated diene-based polymer having an active end by polymerizing or copolymerizing a conjugated diene compound, or a conjugated diene compound and an aromatic vinyl compound with an alkali metal compound or an alkaline earth metal compound used as a polymerization initiator; and a branching step of introducing a branch structure by reacting a styrene derivative as a branching agent with the active end of the conjugated diene-based polymer.

Provided is a heat-curable resin composition capable of yielding a cured product that has a superior dielectric property and heat resistance and is thus useful for high-frequency purposes. Particularly, there are provided a composition containing the following components (A), (C) and (D); and a composition containing the following components (A) and (B). The components (A), (B), (C) and (D) are: (A) a cyclopentadiene compound represented by the following formula (1) and/or an oligomer(s) of the cyclopentadiene compound

##STR00001##

wherein R represents a group selected from an alkyl group, an alkenyl group and an aryl group, n represents an integer of 1 to 4, each of x1 and x2 independently represents 0, 1 or 2, provided that when R represents an alkyl group or an aryl group, x1 represents 1 or 2, and x1 and x2 satisfy 1≤x1+x2≤4; (B) a cyclic imide compound; (C) a curing accelerator; and (D) an inorganic filler.

Recycled rubber is provided, which is formed by depolymerizing 100 parts by weight of rubber and 0.5 to 10 parts by weight of modifier, wherein the modifier is formed by reacting (a) R.sup.1-M, (b) double bond monomer, (c) ethylene sulfide, and (d) polymerization terminator, wherein R.sup.1 is C.sub.4-C.sub.16 alkyl group, M is Li, Na, K, Ba, or Mg and (b) double bond monomer is 1,3-butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 2-phenyl-1,3-butadiene, 4,5-diethyl-1,3-octadiene, styrene, 1-ethylene naphthalene, 3-methylstyrene, 3,5-diethylstyrene, 4-propylstyrene, 2,4,6-trimethylstyrene, 4-dodecylstyrene, 3-methyl-5-n-hexylstyrene, 4-phenylstyrene, 2-ethyl-4-benzylstyrene, 3,5-diphenylstyrene, 2,3,4,5-tetraethyl styrene, 3-ethyl-1-vinylnaphthalene, 6-isopropyl-1-vinylnaphthalene, 6-cyclohexyl-1-vinylnaphthalene, 7-dodecyl-2-vinylnaphthalene, α-methyl styrene, or a combination thereof.

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): ##STR00001## in formula (I), t is an integer ranging from 2 to 6,
wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

The present invention relates to a method of preparing a polyrotaxane, said method comprising: performing a radical copolymerization of at least (a) a first polymerizable monomer having a stopper group, and of at least (b) a second polymerizable monomer, wherein said second monomer is complexed by a ring-shaped molecule; wherein during said copolymerization a copolymer threading said ring-shaped molecule is formed, wherein during said copolymerization said first monomer having a stopper group is incorporated into the chain of said copolymer at least partially between the ends thereof, and wherein said stopper groups prevent said ring-shaped molecule from disassembling from the copolymer; and wherein the amount of said first monomer having a stopper group is of from 0.1 mol % to 20 mol % based on 100 mol % of the total amount of polymerizable monomers. The present invention also relates to polyrotaxanes which can be prepared by using such a method. The present invention further relates to cross-linked polyrotaxanes, products which contain polyrotaxanes or cross-linked polyrotaxanes or which can be prepared from polyrotaxanes or cross-linked polyrotaxanes, and the use of polyrotaxanes or cross-linked polyrotaxanes.

A hard coat film having excellent adhesion (particularly adhesion over time) to a hard coat layer when a cycloolefin polymer film is used as a base material. The hard coat film comprises a hard coat layer containing an ionizing radiation curable resin laminated on at least one surface of a cycloolefin polymer base film via a primer layer. The primer layer has an arithmetic average surface roughness (Ra) in the range of 0.5 nm to 15.0 nm, and a surface of the primer layer has a static friction coefficient in the range of 0.6 to 2.0.

Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.