The present invention relates to a polymer preparation method for preparing water-soluble cationic polymers P1 wherein the halides content is reduced, as well as to the use of these polymers as additives in compositions that are based on inorganic mineral binders or in the treatment of aqueous open, semi-closed, or closed circuits.

The invention is a resin composition containing following polymer (A) and polymer (B), wherein a content of the polymer (A) is 1 to 80 wt % based on the total weight of the polymer (A) and the polymer (B), polymer (A) is a alicyclic structure-containing hydrogenated polymer having a heat distortion temperature of 170 C. or higher, polymer (B) is a polymer incompatible with the polymer (A) and having a heat distortion temperature of lower than 170 C., a microporous film formed by using the resin composition, a separator including the microporous film, and a secondary battery having the separator. One aspect of the invention provides a resin composition suitably used as a raw material for a separator of a secondary battery excellent in safety, a microporous film obtained by forming the resin composition, a separator including the microporous film, and a secondary battery having the separator.

The invention provides a novel hydrophilic polymer and latex polymer blend coating formulation and compositions thereof, and their use on various devices (e.g., prophylactic and medical devices) to form hydrophilic and flexible coatings with durable lubricity.

Provided are a thermally conductive composition that exhibits high adhesive force to an adherend such as a heat-generating element or a heat-dissipating element after curing, and a thermally conductive member in which a cured product of the thermally conductive composition and the adherend are integrated with each other. The thermally conductive composition includes a mixture containing an addition-reaction-type silicone, a thermally conductive filler that includes a metal hydroxide in an amount of 80% by volume or more in terms of volume ratio, and an acryloyl-group-containing silane coupling agent. A thermally conductive member 21 includes a cured body 12 of the thermally conductive composition and an adherend 13 fixed to the cured body 12.

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is ##STR00001##
in which R.sup.1 is CH.sub.2, C(O), or (CH.sub.2)(C.sub.6H.sub.5), and R.sup.2 is H or CH.sub.3.

Embodiments relate to a hard coat laminated film having a first hard coat, a second hard coat, and a transparent resin film layer, where: the first hard coat is formed from paint which contains predetermined amounts of (A) a multifunctional (meth)acrylate, (B) a water repellent, and (C) a silane coupling agent, and which does not contain inorganic particles; and the second hard coat is formed from paint containing predetermined amounts of (D) a polymerizable compound and (E) inorganic fine particles having an average particle size of 1-300 nm. The (D) polymerizable compound contains: (d1) a multifunctional (meth)acrylate having three or more (meth)acryloyl groups in one molecule; (d2) a compound having two or more secondary thiol groups in one molecule; and optionally, (d3) at least one (meth)acrylate selected from the group consisting of a (meth)acrylate having two (meth)acryloyl groups in one molecule, a (meth)acrylate having one (meth)acryloyl group in one molecule, and a urethane(meth)acrylate.

A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

Antioxidant polymer foams and uses thereof are described herein. These foams are synthesized using a Carboni-Lindsey reaction of 1,2,4,5-tetrazine with a polymer having alkenyl functional groups. The foams feature dihydropyridazine functional groups which can be oxidized to consume surrounding reactive oxidizing chemicals and are consequently antioxidant.

A method of producing a polymer aerogel can include dissolving gel precursors consisting of radical polymerizable monomers and crosslinkers, radical initiators, and a chain transfer agent (CTA) in a reaction solvent, wherein the monomers and cross-linkers produce stiff homopolymers; placing the gel precursors into a substrate; polymerizing the gel on the substrate; optionally removing the wet gel from the mold; optionally performing at least one solvent exchange on the gel; and removing the reaction solvent.

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I):

##STR00001## in formula (I), t is an integer ranging from 1 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.