A composite material obtained by impregnating a fibrous filler to which a hydrocarbon-based resin is attached with a polymerizable composition containing a cycloolefin monomer and a metathesis polymerization catalyst is provided. According to the present invention, it is possible to provide a composite material which has no impregnation unevenness and can give a composite material molded article having excellent strength.

A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticizer, 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. According to the present disclosure, the light transmittance of the photovoltaic encapsulating material is improved, and thus the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.

An elastomeric composition and method incorporating a hydrocarbon polymer modifier with improved permanence. The composition comprises elastomer, filler and silane-functionalized hydrocarbon polymer modifier (Si-HPM) made in a pre-reaction adapted to couple the Si-HPM to the elastomer, filler or both, wherein the Si-HPM comprises an interpolymer of monomers chosen from piperylenes, cyclic pentadienes, aromatics, limonenes, pinenes, amylenes, and combinations thereof.

The present invention relates to compositions comprising aversive agent. More specifically, the present invention relates to polymer composite compositions comprising such agents and application thereof.

An extruded foam includes an ethylene-based polymer composition comprising a polymerized ethylene-base monomer with hydrocarbon-based molecules having the following formula (I), where n is from 3 to 160 and m is from 0 to 50.

A method for producing modified polystyrene-based resin particles from which a foamed molded product having little variation in crack resistance can be obtained is provided. The method for producing modified polystyrene-based resin particles includes a polymerization step of obtaining modified polystyrene-based resin particles by copolymerizing a styrene-based monomer and a conjugated diene-based monomer which are impregnated into polystyrene-based resin particles. The polymerization step includes adding a polymerization initiator dissolved in a solvent having an SP value in a specific range and 8 or less carbon atoms.

Provided are a superabsorbent polymer composition, and a preparation method thereof. More particularly, provided are a superabsorbent polymer, of which a high absorption rate and excellent gel strength are improved at the same time by using specific additives in combination during polymerization, and a preparation method thereof.

A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

The present invention relates to a precursor composition for (meth) acrylic thermoplastic composites, its method of preparation and its use. In particular it relates to a semi-fabricated composition comprising a (meth) acrylic polymer, a monomer, a fibrous material and at least one initiator. More particularly the present invention relates to a precursor composition comprising a (meth) acrylic polymer, a monomer, a fibrous material and at least two initiators. The present invention relates also to a method of preparation of a composition comprising a (meth) acrylic polymer, a monomer, a fibrous material and at least two initiators.