A laminate body is provided which contains a thin prepreg having a component (A) containing a matrix of reinforcing fiber, a component (B) containing a thermosetting resin, and a component (C) containing particles of a thermoplastic resin. When molded and cured out of autoclave, the laminate body achieves a fiber-reinforced composite having a low void ratio and providing excellent mechanical performance.

A high-performance triple-crosslinked polymer and a preparation method thereof are provided. The polymer is obtained by curing and cross-linking a monomer having two epoxy groups, a cross-linking monomer and a functional monomer. The polymer contains a cross-linking network formed by covalent bonds and two types of multi-level hydrogen bonds with different strengths. The interaction strength between the covalent bonds and the two types of hydrogen bonds decreases in a gradient. The dilemma of the strength-ductility tradeoff in a high-performance polymer is overcome by forming a triple-crosslinked network with covalent bonds and multi-level hydrogen bonds with different strengths in the polymer. The dynamic and hierarchical hydrogen bonds are broken and recombined timely and continuously to concurrently maintain the complete structure of the polymer network and enable the polymer network to quickly respond to the transmission and dissipation of the external environment.

The invention is directed to a method for attaching nanomaterials containing hexagonal lattices to polymer surfaces. For example, carbon nanotubes (CNTs) can be attached to polycarbonate, polyethylene, or epoxy surfaces by amination of the polymer surface, functionalization of the surfaces of CNTs with ester groups, and reacting the aminated surface of the polymer with the ester groups of the functionalized surfaces of the CNTs in an organic solvent to chemically bind the CNTs to the polymer surface.

The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm

A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×10.sup.3 to 2.0×10.sup.8 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin, [C] curing agent, and [D] thermoplastic resin.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and m represents a number of 0 to 5.

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To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the curing agent is partially or fully a polyvalent hydroxy resin represented by the following general formula (1). Each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and n represents a number of repetitions of 0 to 5.

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A high-performance composite material is provided including a polymer and a hybrid nanoadditive dispersed throughout the polymer at a low concentration and without agglomeration. The hybrid nanoadditive includes a first, graphene oxide portion and a second, polyhedral oligomeric silesquioxane (POSS) portion. Associated extrusion systems and methods are also provided.

An anti-icing honeycomb core composite manufactured by forming an electromagnetic wave absorption layer by using dielectric fiber, molding the electromagnetic wave absorption layer into a honeycomb core structure by using a molded part including a first base, a second base, and an inner block, hardening the honeycomb core structure, and removing the molded part. The molding step includes first stacking, on the first base including a plurality of grooves in which the inner blocks each having a hexagonal column shape are able to be seated, a plurality of the inner blocks and a plurality of the electromagnetic wave absorption layers as the honeycomb core structure so that the electromagnetic wave absorption layer is disposed between the plurality of inner blocks, and second stacking covering the inner blocks and the electromagnetic wave absorption layers stacked on the first base with the second base having the same shape as the first base.

The present invention discloses a foldable FRP plate, comprising a plurality of first regions and one or a plurality of second regions which are integrated in one piece; the second region is located between two adjacent first regions, so that the adjacent first regions being folded and unfolded relative to each other with the second region as a rotating shaft; the first regions are plate-like products manufactured by impregnating fiber woven fabric with resin for curing, are rigid and cannot be folded; the second region is flexible fiber woven fabric and has a width being two times a design thickness of the FRP plate. The present invention also discloses a manufacturing method, including laying the fiber woven fabric according to a design thickness and a layer layout; dividing the first regions and the second region according to an origami design method.