C08J2365/00

CURABLE COMPOSITIONS, COMPOSITE FOAM, METHOD OF MAKING THE SAME, AND ARTICLE INCLUDING THE SAME

A curable composition comprises an addition polymerizable cycloolefin comprising a ring containing a single car-bon-carbon double bond; an addition polymerization catalyst; and at least one of hollow glass microspheres, expanded polymeric mi-crospheres, or expandable polymeric microspheres. The curable composition may be 1-part or 2-part. Methods of curing the curable composition are disclosed. Cured compositions, and articles including the same are also disclosed.

COMPOSITION FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER

A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; W.sub.1 represents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W.sub.1; and W.sub.2 represents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer.

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Electrically conductive hydrogels with tunable properties

A manufacturing method includes: inducing gelation of an electrically conductive polymer to form a gel; infiltrating the gel with a solution including monomers; and polymerizing the monomers to form a secondary polymer network intermixed with the electrically conductive polymer.

FIBER-REINFORCED THERMOPLASTIC RESIN PREPREG AND SHAPED ARTICLE

Provided is a fiber-reinforced thermoplastic resin prepreg which exhibits high interfacial adhesion between reinforcement fibers and a matrix resin, while having excellent interlaminar fracture resistance. The fiber-reinforced thermoplastic resin prepreg of the present invention comprises: a matrix resin comprising a polyarylketone resin and a polyetherimide resin; and a carbon fiber, wherein the polyetherimide resin in the matrix resin comprises a polyetherimide resin having a structural unit represented by Formula (1), an amount of the polyetherimide resin in the matrix resin (100% by mass) is 3% by mass to 25% by mass, and an amount of the polyarylketone resin in the matrix resin (100% by mass) is 75% by mass or more.

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Sebum resistance enhancement for wearable devices
10856069 · 2020-12-01 · ·

A method of treating a wearable device to resist sebum, the method including providing a body having an elastic material having a polymeric backbone where a portion of the polymeric backbone is unsaturated and the body has an outer surface. The method further includes forming a crosslinked matrix within an outer layer of the body surrounding an inner layer of the body such that the outer layer has less affinity to sebum than the inner layer of the body.

FIBER-REINFORCED THERMOPLASTIC RESIN FILAMENT AND SHAPED PRODUCT OF SAME
20200369838 · 2020-11-26 ·

A fiber-reinforced thermoplastic resin filament is obtained by impregnating a continuous reinforcing fiber with a thermoplastic resin, and satisfies all of conditions (a) to (c). (a) The volume ratio of a reinforcing fiber in a fiber-reinforced thermoplastic resin filament is 30 to 80%; and the volume ratio of a thermoplastic resin in a fiber-reinforced thermoplastic resin filament is 70 to 20%. (b) The thickness of a fiber-reinforced thermoplastic resin filament is 0.01 to 3 mm. (c) The length of a filament contained in a fiber-reinforced thermoplastic resin filament is 1 m or more.

Open-Shell Conjugated Polymer Conductors, Composites, and Compositions

The invention provides for polymer structures and their preparation and resulting novel functionalities including open-shell character and high intrinsic conductivity with wide-range tenability. Electrical conductivity can be further modulated by introducing or blending with materials, fillers, dopants, and/or additives. The materials or resultant composites of the invention can be processed by various techniques into different forms to realize multiple applications.

CONDUCTIVE POLYMER NANOCELLULOSE AEROGELS AND USE AS STRAIN SENSOR
20200363273 · 2020-11-19 ·

The present disclosure provides an aerogel comprising conductive polymers and cellulose nanofibrils (CNF). The present disclosure also provides a sensor comprising the aerogels of the present invention.

POLYMER ELECTROLYTE MEMBRANE, MEMBRANE ELECTRODE ASSEMBLY, AND SOLID POLYMER ELECTROLYTE FUEL CELL
20200358119 · 2020-11-12 · ·

A polymer electrolyte membrane of the present disclosure comprises a perfluorosulfonic acid resin (A), wherein the polymer electrolyte membrane has a phase-separation structure having a phase where fluorine atoms are detected in majority and a phase where carbon atoms are detected in majority, in an image of a membrane surface observed under an SEM-EDX, and the polymer electrolyte membrane has a phase having an average aspect ratio of 1.5 or more and 10 or less in an image of a membrane cross-section observed under an SEM.

Gas barrier film

The gas barrier film includes a polymer base having an inorganic layer [A] and a silicon compound layer [B] stacked in this order at least on one side of the polymer base, the inorganic layer [A] containing a zinc compound and silicon oxide, the silicon compound layer [B] containing silicon oxynitride, and the inorganic layer [A] and the silicon compound layer [B] being in contact with each other.