An anion exchange membrane is made by mixing 2 trifluoroMethyl Ketone [nominal] (1.12 g, 4.53 mmol), 1 BiPhenyl (0.70 g, 4.53 mmol), methylene chloride (3.0 mL), trifluoromethanesulfonic acid (TFSA) (3.0 mL) to produce a pre-polymer. The pre-polymer is then functionalized to produce an anion exchange polymer. The pre-polymer may be functionalized with trimethylamine in solution with water. The pre-polymer may be imbibed into a porous scaffold material, such as expanded polytetrafluoroethylene to produce a composite anion exchange membrane.

An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be

##STR00001##

or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen

##STR00002##

or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is

##STR00003##

wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is

##STR00004##

wherein e is 0-10.

Provided is a resin film having excellent size stability in a high-temperature environment. A resin film formed of a resin containing an alicyclic structure-containing polymer having crystallizability, wherein an absolute value of a thermal size change ratio when the film is heated at 150° C. for 1 hour is 1% or less in any in-plane direction of the film. The alicyclic structure-containing polymer may preferably be a hydrogenated product of a ring-opened polymer of dicyclopentadiene. Also provided is a method for producing the resin film including a step of relaxing strain of the crystallized film while the crystallized. film is kept flat.

The present invention relates to a polymer binder composition, and more specifically, to an integrated conductive polymer binder composition simultaneously having adhesion and conductivity, a method for preparing the binder composition, an energy storage device comprising the binder composition, a sensor comprising a sensing portion formed from the binder composition, and an anticorrosive coating composition comprising the binder composition as an active component.

There is provided a curable composition comprising (A) a cyclic olefin; (B) a metathesis catalyst for polymerizing the cyclic olefin; (C) 0.1-30 wt. % of a compound comprising at least one vinyl group; and (D) 0.1-10 wt. % of a curing agent for compound (C), wherein the wt. % are relative to the total weight of the composition. The composition provides a desirable combination of workability, toughness and heat resistance. Also provided is a molded article comprising the composition and reinforcing fibers, and a method of manufacturing the same.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

Microporous polyolefin and microporous polydicyclopentadiene (polyDCPD) based aerogels and methods for preparing and using the same are provided. The aerogels are produced by forming a polymer gel structure within a solvent from a olefin or dicyclopentadiene monomer via Ring Opening Metathesis Polymerization (ROMP) reactions, followed by supercritical drying to remove the solvent from the aerogel. Other aerogels are prepared by sequentially (1) mixing at least one dicyclopentadiene monomer, at least one solvent at least one catalyst and at least one inorganic and/or organic reinforcing material, (2) gelling the mixture, (3) aging, and (4) supercritical drying. Aerogels provided herein are inexpensive to prepare, possess desirable thermal, mechanical, acoustic, chemical, and physical properties and are hydrophobic. The aerogels provided herein are suitable for use in various applications, including but not limited to thermal and acoustic insulation, radiation shielding, and vibrational damping applications.

This invention relates to a supported polymer heterostructure and methods of manufacture. The heterostructure is suitable for use in a range of applications which require semiconductor devices, including photovoltaic devices and light-emitting diodes.

The present invention pertains to a resin formed article obtained by forming a resin composition that comprises a cycloolefin resin and a styrene-based thermoplastic elastomer, the styrene-based thermoplastic elastomer having a weight average molecular weight of 20,000 to 150,000, and having a difference in refractive index (ΔnD) of more than −0.002 to less than +0.002 with respect to the cycloolefin resin, the resin composition having a residual ratio of 0.10 wt % or less when analyzed based on the residue on ignition test method specified in the Japanese Pharmacopeia, the resin composition having a light transmittance (optical path length: 3 mm) of 55% or more with respect to light having a wavelength of 450 nm when the resin composition is formed in a shape of a sheet having a thickness of 3.0 mm, and subjected to light transmittance measurement, and the resin composition having a Charpy impact strength of 5 to 40 kJ/m.sup.2 when the resin composition is formed to have a thickness of 4.0 mm, a length of 80.0 mm, and a width of 10.0 mm, and subjected to the notched Charpy impact test specified in JIS K 7111-1 at 23° C.

A thermosetting polymer formulation includes: 40 to 90 volume percent of a thermosetting polymer system; 10 to 40 volume percent, preferably 20 to 35 volume percent, preferably 20 to 30 volume percent, of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, preferably 8 to 15 micrometers, and a D10 particle diameter of 3 to 7 micrometers, preferably 3 to 5 micrometers, and a D90 particle diameter of 20 to 30 micrometers, preferably 25 to 30 micrometers; a total of 0.01 to 10 volume percent of a coupling agent, an impact modifier, a curing agent, a defoamer, a colorant, a thickening agent, a release agent, an accelerator, or a combination comprising at least one of the foregoing, wherein the volume percentages are based on the total volume of the formulation.