Patent classifications
C08J2367/00
POLYESTER RESIN AQUEOUS DISPERSION COMPOSITION AND METHOD FOR PRODUCING SAME
Provided is a method for efficiently producing an aqueous polyester resin dispersion composition in an excellent emulsification state with excellent adhesiveness. More specifically, provided is a method for producing an aqueous polyester resin dispersion composition, including mixing a melt-kneaded material of polyester and polyvinyl alcohol further with an aqueous solution of 3 to 10 mass% polyvinyl alcohol such that the total content of the polyester and the polyvinyl alcohol in the obtained mixture is 78 to 88 mass%.
MXENE-AROMATIC THERMOSETTING COPOLYESTER NANOCOMPOSITE AS AN EXTREMELY WEAR-RESISTANT BIOCOMPATIBLE IMPLANT MATERIAL FOR OSTEOARTHRITIS APPLICATIONS
Disclosed herein are MXene-aromatic thermosetting copolyester nanocomposites. In one aspect, the nanocomposites can be used to fabricate and/or coat artificial bone implants. In another aspect, the nanocomposites are biocompatible and/or nontoxic. Implants and coatings formed from the nanocomposites possess excellent compressive strength, hardness, and wear resistance in synovial fluid when compared to current implant coatings and materials.
A POLYESTER MOLDING COMPRISING A METAL-ORGANIC FRAMEWORK HAVING A LOW OUTGASSING OF VOLATILE ORGANIC COMPOUNDS
The present invention relates to a molding comprising, (i) a polyester in an amount in the range of from 25 to 99.99 weight-%, based on the total weight of the molding, (ii) a metal-organic framework in an amount of from 0.01 to 25 weight-%, based on the total weight of the molding, wherein the metal-organic framework comprises one or more metal ions M and one or more organic ligands. Further, the present invention relates to a process for preparation of such a molding and use thereof.
METHOD FOR PRODUCING A POLYESTER FILM
A method for producing a polyester film is provided. The method includes a resin alloy master batch preparation step and a film forming step. The resin alloy master batch preparation step includes melting and kneading a high temperature resistant resin material and a polyester resin material with a twin-screw granulator, and then forming a plurality of resin alloy master batches. In the resin alloy master batch preparation step, a twin-screw temperature of the twin-screw granulator is between 250° C. and 320° C., and a twin-screw rotation speed of the twin-screw granulator is between 300 rpm and 800 rpm. The film forming step includes melting and extruding the resin alloy master batches with to form a polyester film. The polyester film includes a heat resistant layer formed of the plurality of resin alloy master batches so that the heat resistant layer includes the high temperature resistant resin material and the polyester resin material.
DAMPING PAD WITH LOW COMPRESSION SET
Provided is a damping pad with low compression set, which is prepared by a method comprising the following steps: (1) providing a polymer comprising a thermoplastic ether ester elastomer, in which the polymer material has specific melt flow index, Shore D hardness, tensile modulus, density, and elongation at break; (2) melting the polymer material to obtain a molten polymer material; (3) adding nitrogen gas or carbon dioxide into the molten polymer to obtain a mixture; (4) turning the mixture into a supercritical state and compounding the mixture, to obtain a supercritical fluid blend; and (5) injecting and molding the supercritical fluid blend to obtain the damping pad with low compression set which has compression set of 40% or less, deceleration value of 20 or less, and rebound resilience of 50% or more.
Damping pad with low compression set
Provided is a damping pad with low compression set, which is prepared by a method comprising the following steps: (1) providing a polymer comprising a thermoplastic ether ester elastomer, in which the polymer material has specific melt flow index, Shore D hardness, tensile modulus, density, and elongation at break; (2) melting the polymer material to obtain a molten polymer material; (3) adding nitrogen gas or carbon dioxide into the molten polymer to obtain a mixture; (4) turning the mixture into a supercritical state and compounding the mixture, to obtain a supercritical fluid blend; and (5) injecting and molding the supercritical fluid blend to obtain the damping pad with low compression set which has compression set of 40% or less, deceleration value of 20 or less, and rebound resilience of 50% or more.
Method for manufacturing TPU hot-melt film and method of producing a fabric product using the TPU hot-melt film
Disclosed is a method of producing a fabric product, the method comprising preparing an upper; preparing a lining fabric; layering a thermoplastic hot-melt film between the upper and the lining fabric for bonding the upper and the lining fabric; bonding a lining fabric to the upper, wherein the thermoplastic hot-melt film consists of the composition selected from the group consisting of thermoplastic polyurethane, ethylene vinyl acetate, polyamide and polyester compositions, wherein the thermoplastic hot-melt film further contains nanosilica, wherein a content of the nanosilica is 0.1 to 5.0 Parts per Hundred Resin (phr) and a size of the nanosilica is less than 100 nm.
Fiber-reinforced resin molding material and molded article
A fiber-reinforced resin molding material is obtained by impregnating a chopped fiber bundle with a matrix resin, has a layered structure including three or more layers in a thickness direction thereof, and satisfies the relationships Lao>Lam and Wao>Wam, where Lao and Wao represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bundle in the outermost layer thereof, and Lam and Wam represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bundle in a middle layer thereof.
Epoxy resin solution
The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.
Coating fluid
The present invention provides a coating fluid including: a hydroxy group-containing resin; an inorganic layered compound; and a liquid medium, in which a ratio (outflow time (B)/outflow time (A)) of outflow time (B) of a coating fluid at 5° C. measured by a Zahn cup to outflow time (A) of a coating fluid at 24° C. measured by a Zahn cup is 1.40 or less.