A thermoplastic bonded preform and method of manufacturing the preform are disclosed. The preform comprises a primary fiber comprising little or no sizing; a mechanical fiber; and a thermoplastic.

The present invention relates to a composition for a moisture permeation preventing film for an electronic device, a method for forming a moisture permeation preventing film for an electronic device using the same, and an electronic device. The present invention can provide: a composition for a moisture permeation preventing film for an electronic device, the composition containing 1-10 wt % of an aerogel, 10-50 wt % of a solvent, 0.1-5 wt % of an additive, and the remainder binder; a method for forming a moisture permeation preventing film for an electronic device using the same; and an electronic device.

A method may produce a heat-resistant resin composite excellent in heat resistance and bending properties. This heat-resistant resin composite is constituted of a matrix resin and reinforcing fibers dispersed in the matrix resin. The matrix resin is constituted of a heat-resistant thermoplastic polymer having a glass transition temperature of 100° C. or higher, and a polyester-based polymer comprising a terephthalic acid unit (A) and an isophthalic acid unit (B) at a copolymerization proportion (molar ratio) of (A)/(B)=100/0 to 40/60. The proportion of the heat-resistant thermoplastic polymer in the composite is 30 to 80 wt %.

Provided are compositions including a population of particulates that comprise an at least partially crystalline polycarbonate having an average cross-sectional dimension of from about 1 to about 200 μm, and have a weight-average molecular weight, per polystyrene standards, of from about 17,000 to about 40,000 Daltons. The composition exhibits a zero-shear viscosity of less than about 10.sup.4 Pa.Math.s at the melting temperature of the partially crystalline polycarbonate. Related systems and methods for utilizing these compositions in additive manufacturing applications, including selective laser sintering (SLS) applications, are also disclosed. Also provided are additively-manufactured articles made with the disclosed compositions and according to the disclosed methods.

Process for manufacturing a densified polymer powder comprising compressing a polymer feed that has a bulk density of less than or equal to 240 kg/m in a roll compactor comprising at least two compaction rolls to obtain a densified polymer material, wherein a gap between the two rolls is 0.5 to 10 mm, wherein the compaction rolls operate at a speed of 3 to 30 rpm, wherein an applied pressure of the roll compactor is 0.5 to 5 MPa, and milling the densified polymer material to obtain a densified polymer powder, wherein a bulk density of the densified polymer powder is greater than or equal to 250 kg/m3.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

Disclosed herein are articles and devices, such as photo-selective films, which may be used to influence the growth of photosynthetic organisms. These article and devices may comprise one or more compounds of Formula (I) and/or Formula (II), along with one or more optional auxiliary dyes. Methods of controlling the growth of plants and for the manufacture of said articles and devices are also disclosed herein.

A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.

The present subject matter relates to self-healing keyboards. In an example implementation, a self-healing keyboard of an electronic device comprises a self-healing film having a self-healing layer disposed over a keyboard. The self-healing layer is composed of polyurethane, epoxy vinyl ester, epoxy, polyurethane microcapsules filled with silane compound, and a polysiloxane mixture.

Provided is a polycarbonate resin having excellent solubility in low-boiling-point non-halogenated solvents and having a high glass transition temperature. The polycarbonate resin includes constituent units (A) represented by general formula (1) and constituent units (B) represented by general formula (2), the molar ratio of the constituent units (A) to the constituent units (B), A/B, being 45/55 to 95/5.

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