C08J2371/00

Circuit materials and articles formed therefrom
09809690 · 2017-11-07 · ·

Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a D.sub.f of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.

THERMOPLASTIC SURFACES COMPRISING DIRECT BONDED CHEMICAL SEALANTS

This disclosure is directed to methods for preparing thermoplastic surfaces suitable for the application of paint, adhesives, or surfacing films and the structures derived or derivable from these methods. The disclosure is also directed to composite structures comprising a thermoplastic substrate comprising a chemical sealant direct bonded to a surface thereof, the chemical sealant providing a surface suitable for adhering adhesives, paints, and/or surfacing films to the thermoplastic surfaces.

PROCESSES FOR INCREASING DENSITY OF POLYMER FLAKES AND POWDERS
20170306075 · 2017-10-26 ·

The present disclosure is directed to improved poly(arylene ether ketone) powders for use in laser sintering, powder coating, compression molding, or transfer molding.

Crosslinked speek cation exchange membrane having improved chemical stability by radiation and method of preparing the same

Provided is a method of preparing a crosslinked sulfonated poly(ether ether ketone) (SPEEK) cation exchange membrane including: preparing a crosslinker mixture of a first crosslinker containing two or more vinyl oxy groups and a second crosslinker containing three or more vinyl groups; preparing a mother liquor containing the crosslinker mixture, a SPEEK polymer substituted with sodium, and a solvent; and casting the mother liquor and then irradiating radiation thereon.

Sulfonate-based compound and polymer electrolyte membrane using same

The present specification relates to a sulfonate-based compound and a polymer electrolyte membrane using the same, a membrane electrode assembly including the same, and a fuel cell including the same.

METHOD FOR PRODUCING HEAT-RESISTANT RESIN COMPOSITE AND HEATRESISTANT RESIN COMPOSITE
20220033595 · 2022-02-03 · ·

A method may produce a heat-resistant resin composite excellent in heat resistance and bending properties. This heat-resistant resin composite is constituted of a matrix resin and reinforcing fibers dispersed in the matrix resin. The matrix resin is constituted of a heat-resistant thermoplastic polymer having a glass transition temperature of 100° C. or higher, and a polyester-based polymer comprising a terephthalic acid unit (A) and an isophthalic acid unit (B) at a copolymerization proportion (molar ratio) of (A)/(B)=100/0 to 40/60. The proportion of the heat-resistant thermoplastic polymer in the composite is 30 to 80 wt %.

METHOD FOR PREPARING FOAM FOR SUPPORTING LIQUID-PHASE COSMETIC MATERIAL AND SAME FOAM

The present invention relates to a method for preparing a foam for impregnating a liquid-phase cosmetic material, wherein the foam can be used while impregnating a liquid-phase or solid-phase cosmetic composition, such as a solution, an emulsion, a gel, a cream, or a suspension. According to the present invention, disclosed is a method for preparing a foam for impregnating a liquid-phase cosmetic material, the method comprising the steps of: (a) preparing a polyester polyol obtained by putting a polyester polyol in a chamber, followed by deflation at a temperature of 55-65° C. and mitigation under conditions of a pressure of 0.1-0.2 kPa for 60 minutes, and then lowering the temperature to 25-35° C. followed by supply of nitrogen and mitigation under conditions of a pressure of 2-3 kPa for 48 hours; (b) preparing a polyether polyol obtained by putting a polyether polyol in a chamber, followed by mitigation under conditions of a temperature of 15-25° C. and a pressure of 0.1-0.2 kPa for 60 minutes, supply of nitrogen, and mitigation under conditions of ,a pressure of 2-3 kPa for 48 hours; (c) injecting and preparing a foaming agent, a catalyst, and a surfactant in tanks according to capacity demands, respectively; (d) sequentially putting, in a mixing and stirring tank, the polyester polyol, polyether polyol, foaming agent, catalyst, and surfactant at a mixing ratio, and then performing continuous foaming with stirring at 5000 rpm under conditions of a temperature of 22-24° C. and a tank internal pressure of 3 kPa; (e) aging, for 48 hours, a foam formed after the completion of the foaming step; and (f) finishing the foam to manufacture a product.

Foam having improved feeling during use

The present invention relates to a foam made of a specific material having superior properties and to cosmetics comprising said foam.

RESIN COMPOSITION AND USES OF THE SAME
20170260367 · 2017-09-14 ·

A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).

RESIN COMPOSITION, COPPER-CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME
20170260364 · 2017-09-14 ·

A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.