The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.975 in a 3-point bending test of the polymer substrate with a hardcoat layer having been subjected to indentation deformation that causes the surface on which the silicon oxide layer is layered to be indented.

Coating compositions including about 50-80% by weight of a water-based silicone elastomer composition, about 0.5-4.0% by weight of a silane adhesion promoter, about 0.02-0.5% by weight of a silicone surfactant, and about 10-50% by weight water are disclosed herein. Also included are methods of preparing the coating compositions and methods of using the coating compositions.

A metal panel reinforcing material comprising a resin composition, including a plastic component that has at least curability and is for a crosslinked polymer matrix, a curing agent for the plastic component, a curing accelerator for the plastic component, and a crosslinked polymer matrix, and a sheet-like fiber substrate, in which when the metal panel reinforcing material is stuck to a metal panel having a thickness of 0.8 mm and heated to be integrated into a reinforced metal panel, the metal panel reinforcing material exhibits the following properties to said metal panel: in three-point bending measured at a span of 100 mm, (i) a strength improvement rate of strength at 1 mm displacement is 120% or more, (ii) a maximum strength improvement rate is 200% or more, and (iii) a strain energy up to a maximum point is 0.5 N.Math.m or more.

The present invention relates generally to methods of preparing vinylidene chloride polymer compositions. In one embodiment, a method of preparing a vinylidene chloride polymer composition comprises (a) adding a first dispersion comprising a wax, a polyolefin or a combination thereof to an aqueous dispersion comprising vinylidene chloride polymer particles; (b) adding an acrylic polymer latex to the aqueous dispersion; and (c) coagulating the wax, the polyolefin, or the combination of the wax and polyolefin, and the acrylic polymer on the surface of the polymer particles.

Coated articles demonstrating anti-reflective properties are provided. Exemplary coated articles comprise a substrate and an anti-reflective coating layer applied to at least one surface of the substrate. The anti-reflective coating layer is formed from an acidic sol-gel composition comprising: (a) tetraalkoxysilane; (b) alkyl trialkoxysilane; (c) a silane-functional acrylic polymer; (d) inorganic oxide particles; (e) a mineral acid; (f) water; and (g) a solvent. The coated article optionally further comprises an outermost anti-fouling coating layer applied to at least one surface of the anti-reflective coating layer.

Disclosed herein is a hard coating composition used in forming a hard coating film exhibiting high hardness and excellent properties. The hard coating composition can be used to prepare a hard coating film exhibiting high impact resistance, high scratch resistance and high transparency and having excellent processability.

A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.

Embodiments described herein are directed to compositions comprising nitrogen containing SMA oligomers or polymers in combination with the phosphonate oligomers or polymers. These compositions may be combined with other polymer resins to produce polymer compositions having good electrical, thermal, and mechanical properties combined with flame retardancy.

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.