A method for manufacturing a substrate material for a semiconductor package, including a step of increasing a temperature of a laminated body in which a metal foil, one or more prepregs, and a metal foil are laminated in this order to a hot-press temperature while pressurizing the laminated body. The prepreg contains an inorganic fiber base material and a thermosetting resin composition. A content of the thermosetting resin composition is 40 to 80% by mass on the basis of a mass of the prepreg. In the step of increasing the temperature of the laminated body to the hot-press temperature while pressurizing the laminated body, the laminated body is heated in a condition in which the lowest melt viscosity of the prepreg is 5000 Pa.Math.s or less.

The present invention provides an electrodeposition-coated article production method which is suitable for producing an electrodeposition-coated article comprising a carbon fiber-reinforced plastic. An electrodeposition-coated article production method according to the present invention includes: a molding step of obtaining a carbon fiber-reinforced plastic molded article by curing a prepreg comprising a carbon fiber reinforcement and a thickened product of an epoxy resin composition in which a bisphenol A epoxy resin, [4-(glycidyloxy)phenyl]diglycidylamine and a curing agent component are mixed; and an electrodeposition coating step of coating the carbon fiber-reinforced plastic molded article by electrodeposition. The epoxy resin composition, when cured at 140° C., gives a cured resin which has a glass transition temperature G′-Tg of more than 100° C. and less than 200° C. and in which a dynamic storage elastic modulus G′ value at 200° C. is more than or equal to 8% of the value at 100° C.

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

A slow reacting recyclable epoxy resin system for structural composites is disclosed. The slow reacting recyclable epoxy resin system comprises an epoxy resin component comprising a high purity epoxy resin selected from a high purity Bisphenol A (BPA) epoxy resin, a high purity Bisphenol F (BPF) epoxy resin and a combination thereof wherein the high purity epoxy resin is in a range of 20 to 95 wt. % of the total weight of the epoxy resin component, a standard epoxy resin selected from a standard bisphenol A (BPA) epoxy resin, a standard Bisphenol F (BPF) epoxy resin and a combination thereof wherein the standard epoxy resin is in a range of 1 to 50 wt. % of the total weight of the epoxy resin component; and a curing agent component comprising a curing agent having at least one cleavage linkage selected from a group comprising of an acetal linkage, a ketal linkage, a formal linkage, an orthoester linkage or a siloxy linkage. The pot life of the slow reacting recyclable epoxy resin system is more than 540 minutes at 25° C.

An epoxy resin composition for carbon-fiber-reinforced composite material includes (A) a bisphenol F-type epoxy resin that is liquid at 25° C., (B) a polyfunctional amine-type epoxy resin, and (C) 3,3′-Diaminodiphenyl sulfone. With respect to 100 parts by mass of the entire epoxy resin in the epoxy resin composition, the content of component (A) is 40 to 60 parts by mass, the content of component (B) is 30 to 45 parts by mass, and the total content of components (A) and (B) is 85 to 100 parts by mass. The content of component (C) satisfies 1.04≤x/y≤1.35, where x is a molar number of active hydrogen atoms in the amine of component (C) and y is a molar number of all epoxy groups in the epoxy resin composition.

An epoxy resin composition is provided that has an elastic modulus, deformability, fracture toughness, and heat resistance in good balance. A prepreg produced from the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg are also provided, where the epoxy resin composition includes the components [A], [B], and [C] and satisfies all of the requirements (1), (2), and (3) as described.

A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×10.sup.3 to 2.0×10.sup.8 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin comprising a m- or p-aminophenol epoxy resin [b1] and either a glycidyl ether epoxy resin or a glycidyl amine epoxy resin [b2] that has two or more glycidyl groups in a molecule, [C] curing agent, and [D] thermoplastic resin.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

This disclosure includes aerogel articles made from aerogel particles and methods for making the same. Some methods include disposing a composition into a mold, the composition having aerogel particles, each including a polymeric matrix defining pores of the aerogel particle, and a plasticizing solvent and/or an adhesive, and forming the aerogel article at least by applying pressure to the composition disposed within the mold.