A sheet molding compound includes an epoxy resin composition meeting (I) and/or (II): (I) a component has a hydroxy group equivalent weight of 20 to 120, and (II) carbon fibers are bundle-shaped aggregates of discontinuous carbon fibers such that in a plane that has a largest width perpendicular to an alignment direction of the carbon fibers, two acute angles, referred to as angle a and angle b, formed between the alignment direction of the carbon fibers and sides formed by arrays of both ends of the carbon fibers in the bundle-shaped aggregates are 2° or more and 30° or less, the epoxy resin composition has a viscosity at 30° C. of 3.0×104 Pa.Math.s or more and 1.0×106 Pa.Math.s or less, and the epoxy resin composition has a viscosity at 120° C. of 1.0×102 Pa.Math.s or more and 5.0×103 Pa.Math.s or less.

A polymeric material for use in thermal insulation is provided. The polymeric material is formed from a thermoplastic composition containing a continuous phase that includes a matrix polymer and within which a microinclusion additive and nanoinclusion additive are dispersed in the form of discrete domains. A porous network is defined in the material that includes a plurality of nanopores having an average cross-sectional dimension of about 800 nanometers or less. The polymeric material exhibits a thermal conductivity of about 0.20 watts per meter-kelvin or less.

A prepreg comprising the following constituent elements (A), (B), and (C), the constituent element (C) being present in a surface layer of the prepreg: Constituent element (A): a reinforcing fiber base material; Constituent element (B): an epoxy resin composition containing a curing agent, the epoxy resin composition being cured within the range of from 90° C. to 140° C. (inclusive); and Constituent element (C): particles of a thermoplastic resin having a melting point or a glass transition temperature within the range of from 90° C. to 140° C. (inclusive).

A rigid polymer foam having specific characteristics in terms of resin absorption, and a structural element made from such rigid polymer foam and adapted to be used as a core layer in a multilayer structural element.

The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.

Disclosed is a preparation method of a renewable epoxy asphalt material and a regeneration process. The preparation method comprises: I Vanillin and 4-aminophenol are reacted in water with stirring to obtain VAN-AP; II. VAN-AP is mixed with epichlorohydrin, to which tetrabutylammonium bromide is added and heated at 80 to 90° C. for reaction; sodium hydroxide solution is then added dropwise for reaction; the mixture is concentrated to obtain GE-VAN-AP; III. Preheated asphalt is mixed with a polyetheramine curing agent and a polyetheramine accelerator to form component A; GE-VAN-AP is melted as component B; the component A is evenly mixed with the component B to obtain a renewable epoxy asphalt material. During the regeneration, the resin phase structure in the epoxy asphalt is gradually depolymerized, whereby asphalt regenerant is used to restore the properties of the aged asphalt phase and reshape the resin phase structure to complete the regeneration.

An example device includes a nanovoided polymer element, a first electrode, and a second electrode. The nanovoided polymer element may be located at least in part between the first electrode and the second electrode. In some examples, the nanovoided polymer element may include anisotropic voids. In some examples, anisotropic voids may be elongated along one or more directions. In some examples, the anisotropic voids are configured so that a polymer wall thickness between neighboring voids is generally uniform. Example devices may include a spatially addressable electroactive device, such as an actuator or a sensor, and/or may include an optical element. A nanovoided polymer layer may include one or more polymer components, such as an electroactive polymer.

The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

The present invention relates to an anti-tack formulation of high solids content that uses effective amounts of a fine particle size talc, a water soluble cationic polymer, one or more nonionic surfactants, and one or more alkali metal fatty acid soaps. The high solids content anti-tack formulation is capable of being easily shipped to a customer's location and is stable and easily pumped after shipment to a customer. The high solids content anti-tack formulation can be diluted to a low solids content formulation for use in anti-tack applications, particularly rubber slab dipping applications. The anti-tack formulation provides improved anti-tack performance when coating uncured rubber products.

A method for manufacturing a fiber-reinforced composite material molded article of the present invention includes a step of causing a reinforcing fiber base material to undergo deformation with use of a mold, the reinforcing fiber base material including: reinforcing fibers which are unidirectionally oriented; and a matrix resin composition. The reinforcing fiber base material has a cut in a zone which is to undergo shear deformation and/or compressive deformation, the cut being substantially parallel to an orientation direction of the reinforcing fibers, and has substantially no cut that cuts through a fiber.