C08J2463/00

Epoxy resin composition, prepreg, and fiber-reinforced composite material

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.

Composition, cured product and laminate

An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

LAMINATED FILM
20210277197 · 2021-09-09 ·

A laminated film has a resin layer on at least one surface of a polyester film, in which the resin layer is on at least one surface layer, the water contact angle of the resin layer is 85°-100°, inclusive, and |H2−H1|≤1.0 (%) is satisfied, H1 (%) being the haze of the laminated film and H2 (%) being the haze of the laminated film after being immersed in a solvent and subjected to a rub test. This laminated film has excellent coating and releasability properties with respect to ceramic slurry.

EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND PRODUCTION METHOD THEREOF
20210261744 · 2021-08-26 · ·

The present invention provides: an epoxy resin composition which has satisfactory handleability during refrigerated transport, is stable and inhibited from increasing in viscosity for a long period even when held at ordinary temperature, well infiltrates into reinforcing fibers, can be sufficiently rapidly cured at a temperature as high as 180° C., and gives molded objects that can be smoothly demolded in a demolding step after the molding since the resin has sufficiently cured and has high heat resistance imparted thereto; and a fiber-reinforced composite material obtained using the epoxy resin composition. The epoxy resin composition for fiber-reinforced composite materials according to the present invention is an epoxy resin composition for use in producing fiber-reinforced composite materials which comprises an epoxy resin and a hardener, and includes tetraglycidyldiaminodiphenylmethane [A], 4,4′-methylenebis(2-isopropyl-6-methylaniline) [B], and a bisphenol F type epoxy resin [C] in a specific proportion. When the viscosities of the resin at 30° C. and 80° C. are expressed by η30 and η80 (unit, mPa.Math.s), respectively, then the epoxy resin composition satisfies 200≤η30/η80≤500 and 50≤η80≤180.

PREPREG

The invention provides a prepreg having high storage stability and serving suitably for producing components, such as structural members and interior members of aircraft and structural members of aircraft engines, that require high heat resistance under high temperature and high humidity conditions, where the prepreg exhibits good physical properties and good combustion properties. The prepreg is produced by impregnating component [A] with an epoxy resin composition containing components [B] to [D], wherein component [A] in the prepreg accounts for 50 mass % or more, where [A] is a carbon fiber, [B] is an epoxy resin, [C] is a fluorene type curing agent having a maximum particle size of 100 μm or less, and [D] is a thermoplastic resin.

Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board

A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.

Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.

RESIN COMPOSITION, RESIN FILM, METAL FOIL WITH RESIN, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.

SOLID DISPERSION, PREPARATION METHOD THEREFOR, CHAIN-EXTENDED POLYURETHANE USING SAME, AND EPOXY RESIN COMPOSITION COMPRISING SAME

The present invention relates to a solid dispersion, a preparation method therefor, a chain-extended polyurethane using same, and an epoxy resin composition comprising same and, more particularly, to a solid dispersion in which an inorganic or organic material-derived isotropic or anisotropic substance is used as a dispersoid and dispersed at room temperature in a solid-phase dispersion medium such as polyols and sugars, whereby the dispersion can be easily stored and used, reduce transportation cost, prevent or alleviate the aggregation or precipitation caused during the storage of products, with the results of working efficiency improvement and processing cost reduction, and, when applied to polyurethane, can increase strength and provide an improved strength, compared to conventional curing agent, a preparation method therefor, a chain-extended polyurethane using same, and an epoxy resin composition comprising same.

EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

The purpose of the present invention is to provide: an epoxy resin composition capable of giving cured resins which combine flexural modulus with flexural strain on a high level and have excellent heat resistance; a prepreg comprising the epoxy resin composition and reinforcing fibers; and a fiber-reinforced composite material obtained by curing the prepreg and excellent especially in terms of 0° and 90° bending strength. An embodiment of the epoxy resin composition of the present invention for achieving such purpose is an epoxy resin composition which comprises the following components [A], [B], and [C] and satisfies a specific requirement. Component [A]: a trifunctional amine type epoxy resin. Component [B]: a bisphenol F type epoxy resin which is solid at 25° C. Component [C]: an aromatic amine compound.