A method for producing a coating layer with scratch resistance and flex resistance, a laminated structure, and a coating composition are provided. The method includes coating the coating composition on a plastic substrate and performing a curing operation on the coating composition to form a cured coating layer. The coating composition includes a polyhedral oligomeric silsesquioxane, a multifunctional epoxy resin, a cationic light initiator, and an organic solvent, and the polyhedral oligomeric silsesquioxane has a cage-like structure. The curing operation has a baking temperature that is within a range from 75° C. to 200° C., a baking time that is within a range from 30 s to 120 s, and an UV curing energy that is within a range from 250 mJ/cm.sup.2 to 1,250 mJ/cm.sup.2.

A surface protect material is described that is high in UV resistance, able to protect the surface of the prepreg used as the parent material, able to prevent a fiber composite material from being deteriorated by UV, able to prevent defects during painting, able to serve for control of the resin flow, and is low in the volatilization percentage during curing, where the surface protect material is a coating agent for spraying or manual application comprising an epoxy resin composition containing at least the components [A] to [D]: [A] non-aromatic epoxy resin, [B] pigment having an number average particle size of 0.1 to 10 μm, [C] non-aromatic thermoplastic resin, and [D] cationic curing agent or anionic curing agent.

An object of the present invention is to provide a composition capable of forming a thermally conductive sheet having excellent peel strength. In addition, another object of the present invention is to provide a thermally conductive sheet formed of the composition and a device with a thermally conductive sheet.

The composition of the present invention contains a disk-like compound, a high-molecular-weight compound which is at least one selected from the group consisting of a thermoplastic resin and rubber, and inorganic particles.

A thermosetting sheet according to the present invention includes a thermosetting resin and a thermoplastic resin, in which a thickness change rate when a temperature is changed from 25° C. to 200° C. is 0% or more and 10% or less.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

The present invention has an object of providing a prepreg for producing a laminate suitable as a structural material, and a laminate, which have excellent combustion resistance, compressive strength and interlaminar fractural toughness values, and can be firmly integrated with another structural member by welding. The present invention is a prepreg including structural components: [A] reinforcing fibers, [B] a thermosetting resin, and [C] a thermoplastic resin [C], wherein [B] includes at least one resin selected from a cyanate ester resin having an average cyanate equivalent of 220 or less, a bismaleimide resin having an average maleimide equivalent of 210 or less, and a benzoxazine resin having an average oxazine equivalent of 300 or less, [C] is present on a surface of the prepreg, and the reinforcing fibers [A] are present which are included in a resin area including [B] and a resin area including [C] across an interface between the two resin areas.

Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are a gas barrier film and a laminate in which the epoxy resin composition is used.

Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.