A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.

The present disclosure provides a unique method of making a fine fiber that is formed from a composition including an epoxy and a polymer component including a 4-vinyl pyridine-containing polymer. The present disclosure also provides a unique method of coating a fine fiber with a composition including an epoxy and a polymer component including a 4-vinyl pyridine-containing polymer. The present disclosure further provides fine fibers wherein the entirety of the fiber is formed from a composition including an epoxy and a polymer component including a 4-vinyl pyridine-containing polymer. Also provided are filter media and filter substrates including the fine fibers.

The present invention relates to a plastic film and a method for manufacturing same. A plastic film, which is formed such that at least one part has a curved shape, can have high hardness, impact resistance, scratch resistance and high transparency. The plastic film is light and will not be easily damaged by external pressure and thus can substitute for the existing glass and is expected to be used for various electronic products such as a display and the like. In particular, the plastic film has at least one part in a curved shape and thereby is expected to be used for products in various shapes which cannot be manufactured by means of the existing glass. Moreover, a method for manufacturing a plastic film enables manufacturing of a plastic film having at least one part in a curved shape without curls or cracks as well as simultaneous performing of heat molding and heat curing, thereby increasing the productivity of a plastic film.

The present disclosure relates to a polycarbonate resin and a method of preparing the same, has an effect of providing a polycarbonate resin having superior chemical resistance and wear resistance due to application of a predetermined comonomer thereto, and a method of preparing the same.

The present invention relates to a prepreg which is manufactured by impregnating thermosetting resin composition and at least one thermoplastic additive into unidirectional carbon fiber, and to a resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same by differentiating a resin constituent, a resin equivalent weight, viscosity, gel time and glass transition temperature differing from those described in the prior art.

A polyalkylene carbonate resin composition with interpenetrating network structure includes an aliphatic polycarbonate obtained through a reaction of carbon dioxide with at least one epoxide compound selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy, (C4-C20)cycloalkylene oxide substituted or unsubstituted with halogen or alkoxy, and (C8-C20)styrene oxide substituted or unsubstituted with halogen, alkoxy, alkyl or aryl, at least one compound selected from a polyol compound, an epoxy compound and an acryl compound, and a curing agent for polymerization or networking.

A black-color polymer composite film comprising a phthalocyanine compound dispersed in a polymer selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof, wherein the phthalocyanine compound occupies a weight fraction of 0.1% to 50% based on the total polymer composite weight. Preferably, the phthalocyanine compound is selected from copper phthalocyanine, zinc phthalocyanine, tin phthalocyanine, iron phthalocyanine, lead phthalocyanine, nickel phthalocyanine, vanadyl phthalocyanine, fluorochromium phthalocyanine, magnesium phthalocyanine, manganous phthalocyanine, dilithium phthalocyanine, aluminum phthalocyanine chloride, cadmium phthalocyanine, chlorogallium phthalocyanine, cobalt phthalocyanine, silver phthalocyanine, a metal-free phthalocyanine, or a combination thereof.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

The present subject matter relates to self-healing keyboards. In an example implementation, a self-healing keyboard of an electronic device comprises a self-healing film having a self-healing layer disposed over a keyboard. The self-healing layer is composed of polyurethane, epoxy vinyl ester, epoxy, polyurethane microcapsules filled with silane compound, and a polysiloxane mixture.