Provided are a conductive thin film, a method for producing same, and an electronic element comprising same. The conductive thin film has excellent conductivity, allows the easy adjustment of a work function, also allows easy film formation, and thus can be advantageously used in various electronic elements, such as organic light-emitting devices and organic solar cells.

A film having first and second segments arranged along the film's width direction. The second segments are more elastic than the first segments. The first segments can include a polymer and a diluent that is miscible with the polymer at a temperature above a melting temperature of the polymer but that phase separates from the polymer at a temperature below a crystallization temperature of the polymer, or the first segments can include at least one of a beta-nucleating agent or thermally induced phase separation caused by a diluent. Laminates and absorbent articles including such films are also disclosed. A method of making the film is also described.

An ink composition for continuous deflected ink jet printing, which is liquid at ambient temperature, comprising: a solvent comprising, preferably consisting of, one or more organic solvent compound(s), and optionally water; a binder, comprising a saturated copolyester resin and a terpene-phenol resin; a compound having an ethylenically unsaturated double bond and a silicon chain; optionally, one or more dye(s) and/or pigment(s). A method for marking a substrate, support or object by spraying this ink composition on a surface of this substrate, support or object. A substrate, support or object, notably a polyolefin bottle or stopper, cap, for example made of polyethylene, provided with a marking obtained by drying, and/or absorption in the substrate, support or object, of this ink composition.

A resin composition is disclosed, comprising 100 parts by weight of a copolymer of phenylvinylsilane and alkenyl compound and 20 parts by weight to 100 parts by weight of a vinylbenzyl-terminated phenolic resin; wherein the raw material of the copolymer of phenylvinylsilane and alkenyl compound comprises a phenylvinylsilane and an alkenyl compound, based on a total weight of the phenylvinylsilane and the alkenyl compound being 100 parts by weight, the phenylvinylsilane is 80 parts by weight to 98 parts by weight, and the alkenyl compound is 2 parts by weight to 20 parts by weight. The resin composition can be made into a product such as a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator.

A polymer is disclosed, having a structure represented by Formula (1), wherein in Formula (1), X is adamantyl group, each of R.sub.1-R.sub.4 is independently hydrogen atom or C1-C3 alkyl group, and n is an integer of 2-50. A resin composition is also disclosed, comprising: (A) an unsaturated carbon-carbon double bond-containing polyphenylene ether resin, and (B) the above polymer. In addition, an article made from the above polymer or the above resin composition is also disclosed. The article comprises a prepreg, a resin film, a laminate or a printed circuit board and has improvements in one or more of the following properties: glass transition temperature, T300 thermal resistance, percent thermal expansion at Z-axis, dissipation factor, dissipation factor variation rate under moisture and heat, dissipation factor variation rate under heat and water absorption rate.

##STR00001##

An object is to obtain a composition capable of: forming a uniform film even by spray coating or even when the composition is applied in the form of ink for inkjet printing; and preventing light emission from a portion other than an ITO electrode surface when the film is mounted on an organic EL device and light is emitted from the device. A conductive polymer composition contains: a composite containing a -conjugated polymer (A) and a polymer (B) shown by a general formula (1); H.sub.2O (D) for dispersing the composite; a water-soluble organic solvent (C); and a compound (E) shown by a general formula (2). The electric conductivity of a film with a thickness of 20 to 200 nm formed from the conductive polymer composition is less than 1.00E-05 S/cm. ##STR00001##

A resin composition contains a hydrocarbon-based compound (A) represented by the following Formula (1): in Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms, which includes at least one selected from an aromatic cyclic group or an aliphatic cyclic group, and n represents an integer from 1 to 10; a polyphenylene ether compound (B) having a reactive carbon-carbon unsaturated double bond; and at least one of a polyfunctional vinyl aromatic copolymer (C) or an acenaphthylene compound (D).

Based on an aramid polymer prepared, the modified aramid dope is prepared through a combination of covalent crosslinking and non-covalent crosslinking. By adjusting the amounts of a crosslinking agent and a polar polymer, an aramid film is obtained that meets the following requirements simultaneously: superior heat resistance and mechanical strength, high toughness, a simple preparation process, high stretchability, and resistance to breakage. Furthermore, the aramid film can be directly laminated with aramid paper without use of an adhesive, so that a flexible composite material in compliance with insulation class F or H is prepared through direct lamination. This application is widely applicable to motors, generators, transformers, adhesive tape, and other fields.