An electroconductive hydrogel is formed by hybrid assembly of polymeric nanofiber networks of conducting polymers that self-organize into highly connected 3D nanostructures with an ultralow threshold (?1 wt %) for electrical percolation. A method for forming the electroconductive hydrogel comprises the steps of: dispersing aramid nanofibers (ANFs) in dimethyl sulfoxide (DMSO); conducting a solvent exchange with water to generate hydrogels with connective 3D fibrillar networks that serve as templates for the assembly of conducting polymers; incorporating polyvinyl alcohol (PVA) during the processing of the hydrogels to weld the fibrillar joints via hydrogen bonding; infiltrating monomers into the nano-porous hydrogels in an aqueous media; and polymerizing the hydrogels with added oxidants.

A binder resin composition for a preform has a Tg of 50 C. to 100 C., a complex viscoelastic coefficient G* determined by dynamic viscoelasticity measurement of 10 kPa to 500 kPa at Tg+30 C., and G* at Tg+30 C./G* at Tg+80 C. of 10 to 300, wherein the viscosity monotonically decreases as temperature of the binder resin composition for a preform rises to 200 C. The binder resin composition is excellent in storage stability at ordinary temperatures and adhesiveness between preform layers at low temperatures, and is capable of exhibiting stable adhesiveness even when the temperature during preform molding is uneven. A reinforcing fiber base material, a preform, and a fiber reinforced composite material include the binder resin composition.

Disclosed herein are a modifier having a continuous phase (A) containing a second polyolefin resin and a dispersed phase (B) containing a polyamide resin and a modified elastomer, wherein the dispersed phase (B) is composed of a melt-kneaded product of the polyamide resin and the modified elastomer having a reactive group, and wherein when a total of the continuous phase (A) and the dispersed phase (B) is 100% by mass, a content of the dispersed phase (B) is 80% by mass or less, a method for using the modifier, including mixing 0.5 parts by mass or more but 70 parts by mass or less of the modifier per 100 parts by mass of a first polyolefin resin, and a method for producing the modifier, including the step of melt-kneading the second polyolefin resin and a melt-kneaded product of the polyamide resin and the modified elastomer.

Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl]4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175 C. and 185 C.

Thermally conductive polymer (TCP) resin compositions are described, comprising components (X) and (Y): 90 to 99.9% component (X) comprising components (I) and (II): 60 to 85% matrix polymer (I) comprising styrenic polymers (F) selected from: ABS resins, ASA resins, and elastomeric block copolymers of the structure (S(B/S)).sub.nS; 15 to 40% thermally conductive filler material (II) (D.sub.50 1 to 200 ), consisting of a ceramic material and/or graphite; 0.1 to 10% chemical foaming agent (Y). Shaped articles made thereof can be used for automotive applications, as a heat sink for high performance electronics, LED sockets or electrical and electronic housings.

A heat-insulating housing (21) includes: a wall body; and an open-cell resin body (4) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells (47); a cell film portion (42); a cell skeleton portion (43); a first through-hole (44) formed so as to extend through the cell film portion; and a second through-hole (45) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole.

A fiber reinforced thermoplastic resin molded article includes 5 to 45 parts by weight of carbon fibers (A), 1 to 45 parts by weight of organic fibers (B), and 10 to 94 parts by weight of a thermoplastic resin (C), based on 100 parts by weight of the total amount of the carbon fibers (A), the organic fibers (B), and the thermoplastic resin (C). The carbon fibers (A) in the fiber reinforced thermoplastic resin molded article have an average fiber length (L.sub.A) of 0.3 to 3 mm. The organic fibers (B) in the fiber reinforced thermoplastic resin molded article have an average fiber length (L.sub.B) of 0.5 to 5 mm, and a number average fiber diameter (d.sub.B) of 1 to 10 m. The fiber reinforced thermoplastic resin molded article excellent in impact strength.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

A resin composition for resin moldings includes: a first resin composition containing a first polyolefin, a polyamide, first carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and second carbon fibers having an average fiber length of 6 mm to 20 mm, wherein of the whole quantity of the resin composition for resin moldings, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, the total contents for the first carbon fiber and the second carbon fiber account for 1 part by mass to 50 parts by mass and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.

A resin composition for resin moldings includes: a first resin composition containing a first polyolefin, a polyamide, first carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and second carbon fibers having an average fiber length of 6 mm to 20 mm, wherein of the whole quantity of the resin composition for resin moldings, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, the total contents for the first carbon fiber and the second carbon fiber account for 1 part by mass to 50 parts by mass and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.