Described is a base material for dry-peelable wallpaper, having greater dimensional stability and improved printability. The problem is solved by a composite fiber web consisting of a voluminous first layer of fiber material, a thermoplastic polymer film, and a second, less voluminous layer of fiber material.

A gas barrier laminate 10 having an inorganic barrier layer 3 and a water-trapping layer 5 that are formed on a plastic base material 1, the water-trapping layer 5 including a matrix of a cationic polymer (a) in which is distributed a hygroscopic agent (b) having such a hygroscopic property as to attain a humidity lower than a humidity that can be attained by using the matrix. The gas barrier laminate exhibits super barrier property against water despite of a structure of a small number of layers.

The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

This application features a method of forming a polymer layer on the surface of a substrate using a self-initiating monomer. A polymer layer is formed by polymerization of a monomer on a metal layer to fill or cover defects of the metal layer. The metal layer the polymer layer may be used as an airtight material.

The invention relates to a gelled, crosslinked and non-dried aqueous polymeric composition capable of forming a non-monolithic organic aerogel by drying, to this aerogel, to a non-monolithic porous carbon resulting from a pyrolysis of this aerogel, to an electrode based on this porous carbon, and to a process for preparing this composition and this aerogel. The invention applies in particular to supercapacitors. A gelled, crosslinked and non-dried composition according to the invention, which is based on a resin resulting at least partly from a polycondensation of polyhydroxybenzene(s) R and formaldehyde(s) F and which comprises at least one water-soluble cationic polyelectrolyte P, is such that the composition is formed from an aqueous dispersion of microparticles of a shear-thinning physical gel that is crosslinked in an aqueous medium. The composition not yet crosslinked is in particular prepared by dilution of a prepolymer that forms this gel in an aqueous solvent in order to form the aqueous dispersion of microparticles of said gel.