A lithium metal secondary battery including a positive electrode, a negative electrode, a separator interposed between the positive electrode and the negative electrode, and a protective layer interposed between the negative electrode and the separator. The protective layer includes an additive, wherein the additive comprises a mixture of hexagonal boron nitride (BN) flakes with an ionomer having a sulfur (S)-containing anionic group and fluorine (F).

A flexible cellular foam or fabric product is coated with a coating including highly thermally conductive nanomaterials. The highly thermally conductive nanomaterials may be carbon nanomaterials, metallic, or non-metallic solids. The carbon nanomaterials may include, but are not necessarily limited to, carbon nanotubes and graphene nanoplatelets. The highly thermally conductive nanomaterials may include but are not limited to nano-sized solids that may include graphite flakes, for example. When coated on a surface of flexible foam, the presence of nanomaterials may impart greater thermal effusivity, greater thermal conductivity, and/or a combination of these improvements. The flexible foam product may be polyurethane foam, latex foam, polyether polyurethane foam, viscoelastic foam, high resilient foam, polyester polyurethane foam, foamed polyethylene, foamed polypropylene, expanded polystyrene, foamed silicone, melamine foam, among others.

Provided is a hollow carbon fiber tube formed by winding a composite material body. The composite material body includes a plurality of carbon fiber prepreg layers and at least one graphene-containing resin layer. Each of the at least one graphene-containing resin layer is disposed between two adjacent carbon fiber prepreg layers. The total thickness of the at least one graphene-containing resin layer is 1/15 to ⅓ of the thickness of the composite material body.

Composite materials that include a phosphor and boron nitride particles. The composite materials may be scintillating materials. The boron nitride particles may be .sup.10B enriched particles. Systems that include composite materials and a detector. Methods of detecting or blocking neutrons. Methods of manufacturing composite materials, including large-area composite materials.

Composite materials that include a phosphor and boron nitride particles. The composite materials may be scintillating materials. The boron nitride particles may be .sup.10B enriched particles. Systems that include composite materials and a detector. Methods of detecting or blocking neutrons. Methods of manufacturing composite materials, including large-area composite materials.

The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt. % of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt. % of polyester-polyether copolymer (B); and 40 to 70 wt. % of scale-like graphite (C) having a fixed carbon content of 98 wt. % or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m.Math.K) or more.

A thermosetting adhesive composition and thermosetting adhesive sheet capable of obtaining stable conductivity even in high-temperature environments or high-temperature/high-humidity environments are provided. The thermosetting adhesive sheet comprises an acrylic copolymer obtained by copolymerizing 55 to 80 wt % of alkyl (meth)acrylate, 15 to 30 wt % of acrylonitrile, and 5 to 15 wt % of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic conductive filler having a tap density of 1.0 to 1.8 g/cm.sup.3. Thereby, thermal expansion after curing is suppressed, and electrical contacts of the conductive filler are increased, allowing stable conductivity to be obtained even in high-temperature environments or high-temperature/high-humidity environments.

A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

A composite material comprising an elastomer having ceramic platelets dispersed therein, and applications thereof including an armour system. The ceramic platelets each have a first plate surface and a second plate surface, the first and second plate surfaces being separated by a height H. The ceramic platelets each having a maximum diameter D measured in the first and second plate surfaces. The ceramic platelets have a mean height H.sub.m and a mean maximum diameter D.sub.m. The mean height H.sub.m is 0.1 to 1 μm and the ratio D.sub.m:Hm is 20 or more.