A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

A catalytic composition for preparing a polyethylene terephthalate (PET) resin is provided. The catalytic composition comprises a polycondensation catalyst and cesium tungsten oxide (Cs.sub.xWO.sub.3-yCl.sub.y), and 0<x1 and 0y0.5. A PET resin prepared by the catalytic composition above is also provided. The PET resin comprises 2-80 ppm of cesium tungsten oxide. This catalytic composition can solve the problems of slow solid-state polymerization rate of the PET preparation and thus the long preparation time, as well as yellowing. Moreover, the PET resin can absorb infrared radiation.

Disclosed are binders and methods for making such binders with crude sterols. The crude sterols improve various rheological properties of the binders.

In an imprint method in a condensable gas atmosphere, the force (mold releasing force) required to separate a mold from a resist cured film (mold release) has been large. A photocurable composition for performing imprint in an atmosphere containing a condensable gas includes a component (A) which is a (meth)acrylate monomer; a component (B) which is a photopolymerization initiator; and a component (C) which is a mold releasing agent. The saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 50% by weight or more, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.

The present invention provides a bio-electrode composition including: a resin containing a main chain having a urethane bond and two side chains each having a silicon-containing group; and an electro-conductive material, wherein the electro-conductive material is a polymer compound having one or more repeating units selected from fluorosulfonic acid salts shown by the following formulae (1)-1 and (1)-2, sulfonimide salts shown by the following formula (1)-3, and sulfonamide salts shown by the following formula (1)-4. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light in weight, manufacturable at low cost, and free from large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition, and a method for manufacturing the bio-electrode.

A golf ball with a core comprising polybutadiene and graphene, and a soft cover is disclosed herein. The golf ball has a dual core with an outer core comprising polybutadiene and graphene. The soft cover is preferably composed of a highly neutralized polymer, a first ionomer, a second ionomer, and a paraloid impact modifier.

A polymer composition having antimicrobial properties, the composition comprising from 50 wt % to 99.99 wt % of a polymer, from 10 wppm to 900 wppm of zinc, less than 1000 wppm of phosphorus, and less than 10 wppm coupling agent and/or surfactant, wherein zinc is dispersed within the polymer; and wherein fibers formed from the polymer composition demonstrate a Klebsiella pneumonia log reduction greater than 0.90, as determined via ISO20743:2013 and/or an Escherichia coli log reduction greater than 1.5, as determined via ASTM E3160 (2018).

The present invention relates to a halogen-free flame retardant resin composition, a prepreg and a copper clad laminate prepared therefrom. The composition of the present invention comprises, based on the weight parts of solid components, (A) from 5 to 80 parts by weight of alkylphenol epoxy resin, (B) from 10 to 80 parts by weight of benzoxazine resin, (C) from 2 to 30 parts by weight of styrene maleic anhydride resin, (D) from 1 to 30 parts by weight of a flame retardant, and (E) from 0.5 to 100 parts by weight of an acidic filler having a pH of 2-6. The present invention further provides a prepreg and a copper clad laminate prepared from the halogen-free flame retardant resin composition. While ensuring a higher glass transition temperature and excellent moisture heat resistance, the halogen-free flame retardant resin composition of the present invention effectively improves the dielectric properties and the peel strength stability of the resin composition, and provides the prepregs and copper clad laminates with excellent comprehensive performances.

The present invention relates to a protective cover for a 5G wireless telecommunications device and, in particular, its use in a method of reducing signal attenuation experienced by a 5G wireless communications device.

The present disclosure provides embodiments of a composition comprising post-consumer recycled resin comprising: at least 50 weight percent polyolefin, having an initial limonene level of at least 5 ppm; virgin ethylene-based polymer; and at least one odor-active zeolite, wherein the odor-active zeolite has an FAU crystal structure, an MFI crystal structure, and/or a beta crystal structure and a Si/Al molar ratio from 1 to 100, wherein the composition has a reduced limonene level of less than 3 ppm. The present disclosure also provides embodiments of a method of reducing taste and/or odor in a post-consumer recycled (PCR) resin-containing composition.