C08L25/00

Antistatic resin composition, and container and packaging material which use same
10053536 · 2018-08-21 · ·

Provided are: an antistatic resin composition which not only has long-lasting and sufficient antistaticity and shows hardly any ion elution when made into a molded article but also is suitable for containers and packaging materials for storage and transport of electrical/electronic components; and a container and a packaging material which comprise the same. The antistatic resin composition includes, with respect to 100 parts by mass of a synthetic resin, 3 to 20 parts by mass of at least one polymer compound (E) and 0.1 to 5 parts by mass of at least one alkali metal salt (F). The polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which comprises at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and a compound (D) having a reactive functional group are bound via ester bonds, or ester bonds and amide bonds:
CH.sub.2CH.sub.2O(1).

Antistatic resin composition, and container and packaging material which use same
10053536 · 2018-08-21 · ·

Provided are: an antistatic resin composition which not only has long-lasting and sufficient antistaticity and shows hardly any ion elution when made into a molded article but also is suitable for containers and packaging materials for storage and transport of electrical/electronic components; and a container and a packaging material which comprise the same. The antistatic resin composition includes, with respect to 100 parts by mass of a synthetic resin, 3 to 20 parts by mass of at least one polymer compound (E) and 0.1 to 5 parts by mass of at least one alkali metal salt (F). The polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which comprises at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and a compound (D) having a reactive functional group are bound via ester bonds, or ester bonds and amide bonds:
CH.sub.2CH.sub.2O(1).

RUBBER COMPOSITION FOR TREAD AND TIRE

The rubber composition for a tread comprises: 5 to 30 parts by mass of a carbon black, 95 parts by mass or more of silica, 25 parts by mass or more of a powder of an inorganic compound represented by a given formula (A) and having an average primary particle size of 10 m or less, and 70 parts by mass or more of a softening agent comprising 2 to 15 parts by mass of a coumarone-based resin, based on 100 parts by mass of a rubber component comprising 70% by mass or more of a styrene-butadiene rubber having a styrene content of from 20 to 50% by mass and a vinyl content of from 15 to 65%, and the tire has a tread composed of the rubber composition for a tread.

Modified planarizing agents and devices

A composition comprising: at least one conjugated polymer, at least one second polymer comprising repeat units represented by: (I) optionally, [CH.sub.2CH(Ph-OH)] and (II) [CH.sub.2CH(Ph-OR)] wherein Ph is a phenyl ring and R comprises a fluorinated group, an alkyl group, an alkylsulfonic acid group, an alkylene oxide group, or a combination thereof is described. Other polymers can be used as second polymer including polymers comprising modified naphthol side groups. Used in hole injection and hole transport layers for organic electronic devices. Increased lifetime and better processability can be achieved. Versatility with useful OLED emitters can be achieved. Ink formulations can be adapted for ink jet printing. The conjugated polymer can be a polythiophene. Applications include OLEDs and OPVs.

Modified planarizing agents and devices

A composition comprising: at least one conjugated polymer, at least one second polymer comprising repeat units represented by: (I) optionally, [CH.sub.2CH(Ph-OH)] and (II) [CH.sub.2CH(Ph-OR)] wherein Ph is a phenyl ring and R comprises a fluorinated group, an alkyl group, an alkylsulfonic acid group, an alkylene oxide group, or a combination thereof is described. Other polymers can be used as second polymer including polymers comprising modified naphthol side groups. Used in hole injection and hole transport layers for organic electronic devices. Increased lifetime and better processability can be achieved. Versatility with useful OLED emitters can be achieved. Ink formulations can be adapted for ink jet printing. The conjugated polymer can be a polythiophene. Applications include OLEDs and OPVs.

Modified planarizing agents and devices

A composition comprising: at least one conjugated polymer, at least one second polymer comprising repeat units represented by: (I) optionally, [CH.sub.2CH(Ph-OH)] and (II) [CH.sub.2CH(Ph-OR)] wherein Ph is a phenyl ring and R comprises a fluorinated group, an alkyl group, an alkylsulfonic acid group, an alkylene oxide group, or a combination thereof is described. Other polymers can be used as second polymer including polymers comprising modified naphthol side groups. Used in hole injection and hole transport layers for organic electronic devices. Increased lifetime and better processability can be achieved. Versatility with useful OLED emitters can be achieved. Ink formulations can be adapted for ink jet printing. The conjugated polymer can be a polythiophene. Applications include OLEDs and OPVs.

Process for the preparation of solid particulate vinyl aromatic polymer compositions
09976006 · 2018-05-22 · ·

A novel process for preparing vinyl aromatic polymer particles is described. The particles and beads are suitable for being processed into foamed styrenic products of substantially improved insulation values, as well as other useful products.

Process for the preparation of solid particulate vinyl aromatic polymer compositions
09976006 · 2018-05-22 · ·

A novel process for preparing vinyl aromatic polymer particles is described. The particles and beads are suitable for being processed into foamed styrenic products of substantially improved insulation values, as well as other useful products.

Resin compositions, resin molded articles, processes for preparing resin molded articles, and laser direct structuring additives

Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 510.sup.3 .Math.cm or less.

Resin compositions, resin molded articles, processes for preparing resin molded articles, and laser direct structuring additives

Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 510.sup.3 .Math.cm or less.