There are provided recycled polystyrene polymers having a melt flow index of less than about 25 g/10 min. There are provided processes for recycling polystyrene waste. The processes can comprise dissolving said polystyrene waste in p-cymene under conditions to obtain a polystyrene/p-cymene mixture, adding the polystyrene/p-cymene mixture to a hydrocarbon polystyrene non-solvent under conditions to obtain precipitated polystyrene and washing the precipitated polystyrene with additional portions of hydrocarbon polystyrene non-solvent under conditions to obtain twice-washed polystyrene. The twice-washed polystyrene can optionally be dried and formed into polystyrene pellets. There is also provided recycled polystyrene obtained from such processes for recycling polystyrene waste.

Disclosed is a molded body and a method for producing the same. The molded body includes: a continuous phase containing first and second polyolefin resins; and a dispersed phase containing a polyamide resin and a modified elastomer and composed of a melt-kneaded product of the polyamide resin and the modified elastomer, the modified elastomer has a reactive group that reacts with the polyamide resin, the elastomer is an olefin-based thermoplastic elastomer having, as a skeleton, a copolymer of ethylene or propylene and an α-olefin having 3-8 carbon atoms or a styrene-based thermoplastic elastomer having a styrene skeleton, when a total of the continuous and dispersed phases is taken as 100% by mass, the dispersed phase is 70% by mass or less, and when a total of the first and second polyolefin resins is taken as 100% by mass, the second polyolefin resin is 80% by mass or less.

Disclosed is a gel material having a high water content and excellent mechanical properties. The gel material includes repeating units derived from the following monomers (A) and (B): (A) an anionic monomer containing a polymerizable carbon-carbon multiple bond and an aromatic ring, and (B) a cationic monomer containing a polymerizable carbon-carbon multiple bond and an aromatic ring. The gel material has a water content of 20% by mass to 95% by mass, a tensile elastic modulus of 9 MPa to 1000 MPa, and a tensile elongation at break of 50% to 5000%.

Disclosed is a gel material having a high water content and excellent mechanical properties. The gel material includes repeating units derived from the following monomers (A) and (B): (A) an anionic monomer containing a polymerizable carbon-carbon multiple bond and an aromatic ring, and (B) a cationic monomer containing a polymerizable carbon-carbon multiple bond and an aromatic ring. The gel material has a water content of 20% by mass to 95% by mass, a tensile elastic modulus of 9 MPa to 1000 MPa, and a tensile elongation at break of 50% to 5000%.

A rubber composition of the present technology contains: diene rubber (A) containing a predetermined amount of specific conjugated diene rubber represented by a predetermined formula; silica having a CTAB adsorption specific surface area in a predetermined range; and a silane coupling agent represented by a predetermined formula.

A rubber composition of the present technology contains: diene rubber (A) containing a predetermined amount of specific conjugated diene rubber represented by a predetermined formula; silica having a CTAB adsorption specific surface area in a predetermined range; and a silane coupling agent represented by a predetermined formula.

An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100° C., and at least one second tackifying resin having a softening point of equal to or higher than 120° C. Further, a method for bonding substrates together using the adhesive composition.

An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100° C., and at least one second tackifying resin having a softening point of equal to or higher than 120° C. Further, a method for bonding substrates together using the adhesive composition.

A polyphenylene sulfide resin composition includes a polyphenylene sulfide resin (A); an aromatic vinyl compound block copolymer (B) containing at least one functional group selected from the group consisting of a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, an epoxy group and an isocyanate group; and an alkoxysilane compound (C) containing at least one functional group selected from the group consisting of an epoxy group, an amino group and an isocyanate group; wherein a phase structure of the polyphenylene sulfide resin composition is a sea-island structure in which the polyphenylene sulfide resin (A) forms a sea phase, and the aromatic vinyl compound block copolymer (B) forms an island phase dispersed in a number average dispersed particle size of 1,000 nm or less.

A polyphenylene sulfide resin composition includes a polyphenylene sulfide resin (A); an aromatic vinyl compound block copolymer (B) containing at least one functional group selected from the group consisting of a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, an epoxy group and an isocyanate group; and an alkoxysilane compound (C) containing at least one functional group selected from the group consisting of an epoxy group, an amino group and an isocyanate group; wherein a phase structure of the polyphenylene sulfide resin composition is a sea-island structure in which the polyphenylene sulfide resin (A) forms a sea phase, and the aromatic vinyl compound block copolymer (B) forms an island phase dispersed in a number average dispersed particle size of 1,000 nm or less.