The rubber composition for a tread comprises: 5 to 30 parts by mass of a carbon black, 95 parts by mass or more of silica, 25 parts by mass or more of a powder of an inorganic compound represented by a given formula (A) and having an average primary particle size of 10 m or less, and 70 parts by mass or more of a softening agent comprising 2 to 15 parts by mass of a coumarone-based resin, based on 100 parts by mass of a rubber component comprising 70% by mass or more of a styrene-butadiene rubber having a styrene content of from 20 to 50% by mass and a vinyl content of from 15 to 65%, and the tire has a tread composed of the rubber composition for a tread.

The instant invention provides a polyethylene blend-composition suitable for blown films, and films made therefrom. The polyethylene blend-composition suitable for blown films comprises the melt blending product of: (a) from 0.5 to 4 percent by weight of a low density polyethylene having a density in the range of from 0.915 to 0.935 g/cm.sup.3, and a melt index (I.sub.2) in the range of from greater than 0.8 to less than or equal to 5 g/10 minutes, and a molecular weight distribution (M.sub.w/M.sub.n) in the range of from 6 to 10; (b) 90 percent or greater by weight of an ethylene/-olefin interpolymer composition, wherein ethylene/-olefin interpolymer composition has a Comonomer Distribution Constant (CDC) in the range of from 75 to 200, a vinyl unsaturation of less than 0.1 vinyls per one thousand carbon atoms present in the backbone of the ethylene/-olefin interpolymer composition; a zero shear viscosity ratio (ZSVR) in the range from 2 to 20; a density in the range of from 0.903 to 0.950 g/cm.sup.3, a melt index (I.sub.2) in a range of from 0.1 to 5 g/10 minutes, a molecular weight distribution (M.sub.w/M.sub.n) in the range of from 1.8 to 3.5; (c) optionally a hydrotalcite based neutralizing agent; (d) optionally one or more nucleating agents; (e) and optionally one or more antioxidants.

There are provided recycled polystyrene polymers having a melt flow index of less than about 25 g/10 min. There are provided processes for recycling polystyrene waste. The processes can comprise dissolving said polystyrene waste in p-cymene under conditions to obtain a polystyrene/p-cymene mixture, adding the polystyrene/p-cymene mixture to a hydrocarbon polystyrene non-solvent under conditions to obtain precipitated polystyrene and washing the precipitated polystyrene with additional portions of hydrocarbon polystyrene non-solvent under conditions to obtain twice-washed polystyrene. The twice-washed polystyrene can optionally be dried and formed into polystyrene pellets. There is also provided recycled polystyrene obtained from such processes for recycling polystyrene waste.

A thermally insulating composition comprising hollow spherical silica particles and a coating of a material having a thermal conductivity of less than 0.3 W/m.Math.K on surfaces of said silica particles. In particular embodiments, the low conductivity coating material may be a polymer, such as polystyrene or polyvinylpyrrolidone, or the low conductivity coating material may be a quaternary ammonium salt of the Formula (1), i.e., R.sup.1R.sup.2R.sup.3R.sup.4N.sup.+A.sup., with at least one of R.sup.1, R.sup.2, R.sup.3, and R.sup.4 being an alkyl group containing at least ten carbon atoms (and A.sup. is a counter anion), or the low conductivity coating material may be phenyl-C61-butyric acid methyl ester covalently bound to the hollow spherical silica particles. Also described herein is a method of thermally insulating a surface by applying a coating of the thermally insulating composition, described above, onto the surface.

An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100 C., and at least one second tackifying resin having a softening point of equal to or higher than 120 C. Further, a method for bonding substrates together using the adhesive composition.

An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100 C., and at least one second tackifying resin having a softening point of equal to or higher than 120 C. Further, a method for bonding substrates together using the adhesive composition.

Disclosed is a molded body and a method for producing the same. The molded body includes: a continuous phase containing first and second polyolefin resins; and a dispersed phase containing a polyamide resin and a modified elastomer and composed of a melt-kneaded product of the polyamide resin and the modified elastomer, the modified elastomer has a reactive group that reacts with the polyamide resin, the elastomer is an olefin-based thermoplastic elastomer having, as a skeleton, a copolymer of ethylene or propylene and an -olefin having 3-8 carbon atoms or a styrene-based thermoplastic elastomer having a styrene skeleton, when a total of the continuous and dispersed phases is taken as 100% by mass, the dispersed phase is 70% by mass or less, and when a total of the first and second polyolefin resins is taken as 100% by mass, the second polyolefin resin is 80% by mass or less.

The present invention provides polymer composites, such as films, having dispersed therein quantum dots, wherein the polymer comprises (b) polymerized units of a first compound comprising from one to 6 thiol groups, the compound having a molecular weight from 300 to 20,000 and having at least one continuous acyclic hydrocarbyl chain of at least three carbon atoms, or, preferably, at least 5 carbon atoms; and (c) polymerized units of a second compound having a molecular weight from 100 to 750 and comprising at least two polymerizable vinyl groups as part of a (meth)acrylate ester group or attached directly to an aromatic ring and, wherein the molecular weight of the first compound minus the molecular weight of the second compound is at least 100. The polymer composites provide more stably dispersed and durable quantum dot compositions for use in, for example, display devices.

The present invention provides polymer composites, such as films, having dispersed therein quantum dots, wherein the polymer comprises (b) polymerized units of a first compound comprising from one to 6 thiol groups, the compound having a molecular weight from 300 to 20,000 and having at least one continuous acyclic hydrocarbyl chain of at least three carbon atoms, or, preferably, at least 5 carbon atoms; and (c) polymerized units of a second compound having a molecular weight from 100 to 750 and comprising at least two polymerizable vinyl groups as part of a (meth)acrylate ester group or attached directly to an aromatic ring and, wherein the molecular weight of the first compound minus the molecular weight of the second compound is at least 100. The polymer composites provide more stably dispersed and durable quantum dot compositions for use in, for example, display devices.

Waterborne dispersions including crosslinkable multistage polymeric particles useful in coating compositions are provided. The multistage particles have a last-formed layer that includes a diketone functionality that is capable of crosslinking via a dihydrazide component also included in the dispersion. Another embodiment of the waterborne dispersion further includes crosslinkable latex particles having a diketone functionality that are capable of crosslinking with each other and/or the multistage particles via the dihydrazide component. An emulsion polymerization process for forming the multistage particles also is provided. Also provided are coating compositions that contain either embodiment of the waterborne dispersions.