To provide a negative type photosensitive composition having excellent chemical resistance and capable of being cured at a low temperature. A negative type photosensitive composition comprising (I) a polysiloxane having a specific structure, (II) a polymerization initiator, (III) a compound containing two or more (meth)acryloyloxy groups, and (IV) a solvent.

To provide a negative type photosensitive composition having excellent chemical resistance and capable of being cured at a low temperature. A negative type photosensitive composition comprising (I) a polysiloxane having a specific structure, (II) a polymerization initiator, (III) a compound containing two or more (meth)acryloyloxy groups, and (IV) a solvent.

Photocurable compositions comprising 20-90% by weight of a polymerizable core resin; 20-90% by weight of a diluent resin miscible with said core resin; and at least about 1% by weight of at least one rheology modifier which is distinct from said diluent resin. Rheology modifiers of the present disclosure include compounds which may form covalent bonds with the core resin or diluent resin and compounds which have a particle size of 1-200 nm. Rheology modifiers which may form covalent bonds have at least one terminal functional group selected from the group consisting of acrylates, methacrylates, epoxides, oxetanes, nitriles, alkenes and alkynes.

Photocurable compositions comprising 20-90% by weight of a polymerizable core resin; 20-90% by weight of a diluent resin miscible with said core resin; and at least about 1% by weight of at least one rheology modifier which is distinct from said diluent resin. Rheology modifiers of the present disclosure include compounds which may form covalent bonds with the core resin or diluent resin and compounds which have a particle size of 1-200 nm. Rheology modifiers which may form covalent bonds have at least one terminal functional group selected from the group consisting of acrylates, methacrylates, epoxides, oxetanes, nitriles, alkenes and alkynes.

Briefly, the present disclosure provides a film, tape or outer layer of a composite part comprising: a) at least one layer comprising a crosslinked polymer selected from the group consisting of crosslinked polyurethane, crosslinked polyurea, and crosslinked mixed polyurethane/polyurea polymer; and in some embodiments b) an adhesive layer. In some embodiments the layer additionally comprises a non-crosslinked polymer forming a semi-IPN with the crosslinked polymer. In some embodiments the non-crosslinked polymer may be selected from the group consisting of polyurethane, polyurea, and mixed polyurethane/polyurea polymer. In some embodiments the crosslinked polymer may additionally comprise an acrylate-containing component.

A wet friction material includes a base including a matrix of fibers and filler particles embedded in the matrix of fibers; a binder embedded in an interior of the base; and a quaternary ammonium salt containing coating on an outer surface of the base. The quaternary ammonium salt containing coating can include a quaternary ammonium salt and a solution binder

A wet friction material includes a base including a matrix of fibers and filler particles embedded in the matrix of fibers; a binder embedded in an interior of the base; and a quaternary ammonium salt containing coating on an outer surface of the base. The quaternary ammonium salt containing coating can include a quaternary ammonium salt and a solution binder

A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.

A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.

Non-aqueous dental adhesive comprising a mixture containing (i) one or more polymerizable monomers optionally containing an acidic group, (ii) a polymerization initiator, and (iii) a thermal polymerization inhibitor of the following formula (I) ##STR00001##
wherein
R′.sub.1 represents a hydrogen atom, or a saturated hydrocarbon group having 1 to 18 carbon atoms. R′.sub.2, which may be the same or different if more than one R′.sub.2 is present, independently represent a saturated hydrocarbon group having 1 to 18 carbon atoms, and c represents an integer of from 1 to 4, and (iv) optionally an organic solvent.