The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.

It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

The present invention pertains to a slurry composition for non aqueous electrolyte battery electrodes that includes a binder composition, an active material, and a solvent, in which the active material is a lithium-containing metal oxide, the binder composition contains a neutralized salt of an -olefin-maleic acid copolymer in which an -olefin and a maleic acid are copolymerized, and the degree of neutralization for carboxylic acid generated from the maleic acid in the copolymer is from 0.3 to 1.0. The present invention further pertains to a non aqueous electrolyte battery positive electrode and a non aqueous electrolyte battery using the slurry composition for non aqueous electrolyte battery electrodes.

The present invention pertains to a slurry composition for non aqueous electrolyte battery electrodes that includes a binder composition, an active material, and a solvent, in which the active material is a lithium-containing metal oxide, the binder composition contains a neutralized salt of an -olefin-maleic acid copolymer in which an -olefin and a maleic acid are copolymerized, and the degree of neutralization for carboxylic acid generated from the maleic acid in the copolymer is from 0.3 to 1.0. The present invention further pertains to a non aqueous electrolyte battery positive electrode and a non aqueous electrolyte battery using the slurry composition for non aqueous electrolyte battery electrodes.

The present invention relates to a binder composition for a non-aqueous electrolyte battery, which is characterized by containing (A) polyvinyl alcohol, (B) at least one selected from a copolymer of vinyl alcohol and ethylenically unsaturated carboxylic acid and a neutralized salt of the copolymer and (C) at least one selected from an amino acid, a carboxylic acid-containing polymer and a polyamine; and a binder aqueous solution for a non-aqueous electrolyte battery, a slurry composition for a non-aqueous electrolyte battery, an electrode for a non-aqueous electrolyte battery, and a non-aqueous electrolyte battery, each containing the binder composition; and others.