A resist composition including a polymer; and a compound represented by Formula 1, ##STR00001## in Formula 1, R.sub.1 is hydrogen, a halogen, an alkyl group having 1 to 7 carbon atoms, a carbonyl group having 1 to 7 carbon atoms, an ester group having 1 to 7 carbon atoms, an acetal group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an ether group having 1 to 7 carbon atoms, or a group represented by Formula R, and R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are hydrogen, a halogen, an alkyl group having 1 to 7 carbon atoms, an ester group having 1 to 7 carbon atoms, an acetal group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, or an ether group having 1 to 7 carbon atoms, ##STR00002##

Provided are a polycarbonate/ABS-based thermoplastic resin composition excellent in hydrolysis resistance and impact resistance and a molded article thereof. A thermoplastic resin composition includes: polycarbonate (A); a graft copolymer (B) produced by graft copolymerization of a rubbery polymer at least with a styrene-based monomer and an acrylonitrile-based monomer and containing a metal element; a styrene-acrylonitrile based copolymer (C); and an unsaturated dicarboxylic anhydride-based copolymer (D), wherein a content of (D) is 2 to 25 mass %.

Provided are a polycarbonate/ABS-based thermoplastic resin composition excellent in hydrolysis resistance and impact resistance and a molded article thereof. A thermoplastic resin composition includes: polycarbonate (A); a graft copolymer (B) produced by graft copolymerization of a rubbery polymer at least with a styrene-based monomer and an acrylonitrile-based monomer and containing a metal element; a styrene-acrylonitrile based copolymer (C); and an unsaturated dicarboxylic anhydride-based copolymer (D), wherein a content of (D) is 2 to 25 mass %.

The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.

The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.

An insulated wire includes an outermost layer including a resin composition including a fluorine-containing elastomer. A ratio of C═O bond to C—C bond (C═O/C—C) on a surface of the outermost layer is not less than 0.5. The resin composition further includes a tetrafluoroethylene-propylene copolymer and an ethylene-tetrafluoroethylene copolymer as the entire base polymer or a portion of the base polymer at a mass ratio ((of the tetrafluoroethylene-propylene copolymer) to (the ethylene-tetrafluoroethylene copolymer)) in a range of 100:0 to 60:40. The resin composition further includes 5 to 60 parts by mass of calcium carbonate and/or silica as an inorganic filler with respect to 100 parts by mass of the base polymer. The resin composition is cross-linked.

An insulated wire includes an outermost layer including a resin composition including a fluorine-containing elastomer. A ratio of C═O bond to C—C bond (C═O/C—C) on a surface of the outermost layer is not less than 0.5. The resin composition further includes a tetrafluoroethylene-propylene copolymer and an ethylene-tetrafluoroethylene copolymer as the entire base polymer or a portion of the base polymer at a mass ratio ((of the tetrafluoroethylene-propylene copolymer) to (the ethylene-tetrafluoroethylene copolymer)) in a range of 100:0 to 60:40. The resin composition further includes 5 to 60 parts by mass of calcium carbonate and/or silica as an inorganic filler with respect to 100 parts by mass of the base polymer. The resin composition is cross-linked.

Provided is a polyamide resin composition capable of achieving high toughness and high breaking strain at the same time. Also provided is a molded article produced by molding the polyamide resin composition, and a method for manufacturing the molded article using the polyamide resin composition. A polyamide resin composition comprising: 100 parts by weight of polyamide resin (A) that is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid, and 0.05 to 0.45 parts by weight of an olefin-maleic anhydride copolymer (B), wherein 50 mol % or more of the structural unit derived from diamine is derived from at least one of metaxylylenediamine and paraxylylenediamine; the molar ratio of the structural unit derived from metaxylylenediamine and the structural unit derived from paraxylylenediamine is 100:0 to 40:60; 50 mol % or more of the structural unit derived from dicarboxylic acid is derived from sebacic acid; and the polyamide resin (A) has a terminal amino group concentration of 10 to 30 μeq/g.

Provided is a polyamide resin composition capable of achieving high toughness and high breaking strain at the same time. Also provided is a molded article produced by molding the polyamide resin composition, and a method for manufacturing the molded article using the polyamide resin composition. A polyamide resin composition comprising: 100 parts by weight of polyamide resin (A) that is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid, and 0.05 to 0.45 parts by weight of an olefin-maleic anhydride copolymer (B), wherein 50 mol % or more of the structural unit derived from diamine is derived from at least one of metaxylylenediamine and paraxylylenediamine; the molar ratio of the structural unit derived from metaxylylenediamine and the structural unit derived from paraxylylenediamine is 100:0 to 40:60; 50 mol % or more of the structural unit derived from dicarboxylic acid is derived from sebacic acid; and the polyamide resin (A) has a terminal amino group concentration of 10 to 30 μeq/g.

The present invention provides a binder that is for inorganic fibers and that is characterized by containing (A) 100 parts by mass of a polyvinyl alcohol resin having a degree of polymerization of 100-3500, (B) 1-50 parts by mass of colloidal silica having an average particle size of 100 nm or less, and (C) 3 parts by mass or more of an ammonia-modified copolymer containing maleic anhydride. By using the binder for inorganic fibers according to the present invention, an inorganic fiber mat having resiliency comparable to that of phenolic resins can be fabricated, and the amount of volatile organic compounds released from the inorganic fiber mat is very small.