The present invention relates to a thermoplastic resin composition with excellent chemical resistance and, more specifically, to a resin composition for blow molding and a molded product obtained by molding the same, the composition maintaining the balance of flowability and impact resistance and improving chemical resistance by controlling the glass transition temperature (Tg) and the weight average molecular weight (Mw) of an α-methylstyrene (AMS)-based heat-resistant resin in a copolymer of vinyl cyanide compound-rubbery polymer-aromatic vinyl compound, having reinforced heat resistance, particularly, in an acrylonitrile-butadiene-styrene (ABS) copolymer resin. According to the present invention, an ABS resin composition for blow molding, having excellent chemical resistance while maintaining the balance of flowability, impact resistance and heat resistance to be of at least the same level, and a molded product obtained by applying the same can be obtained.

The present invention relates to a thermoplastic resin composition with excellent chemical resistance and, more specifically, to a resin composition for blow molding and a molded product obtained by molding the same, the composition maintaining the balance of flowability and impact resistance and improving chemical resistance by controlling the glass transition temperature (Tg) and the weight average molecular weight (Mw) of an α-methylstyrene (AMS)-based heat-resistant resin in a copolymer of vinyl cyanide compound-rubbery polymer-aromatic vinyl compound, having reinforced heat resistance, particularly, in an acrylonitrile-butadiene-styrene (ABS) copolymer resin. According to the present invention, an ABS resin composition for blow molding, having excellent chemical resistance while maintaining the balance of flowability, impact resistance and heat resistance to be of at least the same level, and a molded product obtained by applying the same can be obtained.

A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I),

##STR00001## wherein a, R, and M.sup.a+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).

A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I),

##STR00001## wherein a, R, and M.sup.a+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).

The present invention concerns a two-part sizing composition comprising: (A) A precursor comprising: (a) An aminosilane (e.g. A1100) and (b) a polymer or copolymer containing carboxylic acid and/or anhydride, both having a functionality, F≧3, and (B) A binder comprising a multi-functional epoxy resin of functionality, F≧3. Glass fibres sized with the reaction product of the above composition yield a higher resistance to hydrolysis of polymeric matrix composite materials reinforced with such fibres. The sizing composition of the present invention is particularly advantageous for use with polyester resins, such as PET.

The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C).

##STR00001##

In the formula (1), R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.

The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C).

##STR00001##

In the formula (1), R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.

A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C):

##STR00001##

wherein R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.

A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.

A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.