The present invention relates to a composition for blow-molding or extrusion, in particular blow-molding, comprising by weight: a) from 88 to 99.95%, more particularly from 89 to 99.9%, in particular from 93 to 99.9%, of at least one semicrystalline aliphatic polyamide having a carbon number per nitrogen atom of greater than or equal to 7, more particularly greater than or equal to 8, b) from 0.05% to 10%, more particularly from 0.1% to 9%, in particular from 0.1% to 5% by weight of at least one branching agent chosen from polyepoxides, polyanhydrides, more particularly polymaleic anhydrides and polyepoxides, c) from 0 to 2% of at least one additive, more particularly from 0.1 to 2%, the composition having, after compounding, a melt viscosity of from 10 000 to 300 000 Pa.Math.s, preferably from 15 000 to 220 000 Pa.Math.s, as measured in plane-plane geometry according to standard 6721-10:2015 at a temperature of 250? C., a frequency of 0.292 rad/s and a deformation of 2%, the sum of the constituents a)+b)+c) making 100% by weight.

Fouling in a hydrocarbon refining process is reduced by adding to a crude hydrocarbon for a refining process, an additive combination including: (A) a polyalkenyl-substituted carboxylic acid or anhydride, and (B) an overbased metal hydrocarbyl-substituted hydroxybenzoate detergent,
where the mass:mass ratio of (A) to (B) is in the range of 10:1 to 1:10, and the treat rate of the additive combination is in the range of 5 to 1000 ppm by mass.

A protective, sacrificial, water-reversible, coating composition for the protection of substrates comprised of water, a volatile base, a film-forming acrylic polymer in a water dispersion form, a compatabilizing polymer, specifically poly (2-ethyl-2-oxazoline), a poly acidic polymer (pH specific in terms of its solubility), wherein said coating is both water applied and water reversible or re-soluble under specific pH conditions.

A protective, sacrificial, water-reversible, coating composition for the protection of substrates comprised of water, a volatile base, a film-forming acrylic polymer in a water dispersion form, a compatabilizing polymer, specifically poly (2-ethyl-2-oxazoline), a poly acidic polymer (pH specific in terms of its solubility), wherein said coating is both water applied and water reversible or re-soluble under specific pH conditions.

The present invention relates to a composition for an insulator of a thin film transistor, an insulator and an organic thin film transistor comprising the same. The insulator of a thin film transistor prepared with the composition of the present invention displays an excellent permittivity along with a low surface energy, and the organic thin film transistor comprising the same displays an improved organic semiconductor morphology formed on the top surface of the insulator, so that it can bring the effect of reducing leakage current density, improving charge carrier mobility, and improving current on/off ratio.

The present invention relates to a composition for an insulator of a thin film transistor, an insulator and an organic thin film transistor comprising the same. The insulator of a thin film transistor prepared with the composition of the present invention displays an excellent permittivity along with a low surface energy, and the organic thin film transistor comprising the same displays an improved organic semiconductor morphology formed on the top surface of the insulator, so that it can bring the effect of reducing leakage current density, improving charge carrier mobility, and improving current on/off ratio.

Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.