An example of a flow cell includes a substrate, which includes nano-depressions defined in a surface of the substrate, and interstitial regions separating the nano-depressions. A hydrophobic material layer has a surface that is at least substantially co-planar with the interstitial regions and is positioned to define a hydrophobic barrier around respective sub-sets of the nano-depressions.

A composition including a copolymer containing polyamide blocks and polyether blocks including at least one carboxylic acid chain end having reacted with an epoxide function, the process for preparing same, and also the use thereof. A foam formed from this composition, the process for preparing same, and the use thereof.

A composition including a copolymer containing polyamide blocks and polyether blocks including at least one carboxylic acid chain end having reacted with an epoxide function, the process for preparing same, and also the use thereof. A foam formed from this composition, the process for preparing same, and the use thereof.

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

An example of a flow cell includes a substrate, which includes nano-depressions defined in a surface of the substrate, and interstitial regions separating the nano-depressions. A hydrophobic material layer has a surface that is at least substantially co-planar with the interstitial regions and is positioned to define a hydrophobic barrier around respective sub-sets of the nano-depressions.

An example of a flow cell includes a substrate, a plurality of chambers defined on or in the substrate, and a plurality of depressions defined in the substrate and within a perimeter of each of the plurality of chambers. The depressions are separated by interstitial regions. Primers are attached within each of the plurality of depressions, and a capture site is located within each of the plurality of chambers.

An example of a flow cell includes a substrate, which includes nano-depressions defined in a surface of the substrate, and interstitial regions separating the nano-depressions. A hydrophobic material layer has a surface that is at least substantially co-planar with the interstitial regions and is positioned to define a hydrophobic barrier around respective sub-sets of the nano-depressions.

The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied: (i) the resin composition includes a polymer (P1) including: a structural unit (A) represented by the following formula (1); and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; and (ii) the resin composition includes: a polymer (P2) including the structural unit (A); and a polymer (P3) including the structural unit (B).

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The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied: (i) the resin composition includes a polymer (P1) including: a structural unit (A) represented by the following formula (1); and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; and (ii) the resin composition includes: a polymer (P2) including the structural unit (A); and a polymer (P3) including the structural unit (B).

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